OPT101_03 BURR-BROWN [Burr-Brown Corporation], OPT101_03 Datasheet - Page 4

• Manufacturer Part Number: OPT101_03
• Description: MONOLITHIC PHOTODIODE AND SINGLE-SUPPLY TRANSIMPEDANCE AMPLIFIER
• Manufacturer: BURR-BROWN [Burr-Brown Corporation]

PACKAGE/ORDERING INFORMATION
NOTES: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet. (2) 8-pin DIP with J-formed
leads for surface mounting.
PIN CONFIGURATIONS
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
4
ABSOLUTE MAXIMUM RATINGS
PRODUCT
OPT101P
OPT101P-J
Supply Voltage (V
Output Short-Circuit (to ground) ............................................... Continuous
Operating Temperature .................................................... –25 C to +85 C
Storage Temperature ........................................................ –25 C to +85 C
Junction Temperature ...................................................................... +85 C
Lead Temperature (soldering, 10s) ............................................... +300 C
Top View
(Vapor-Phase Soldering Not Recommended)
1M Feedback
S
–In
–V
to “Common” or pin 3) ................................ 0 to +36V
V
DIP-8, Surface Mount
NOTE: (1) Photodiode location.
S
PACKAGE-LEAD
1
2
3
4
DIP-8
(1)
(2)
8
7
6
5
(1)
DESIGNATOR
Common
NC
NC
Output
PACKAGE
NTC
DTL
(1)
DIP
TEMPERATURE
www.ti.com
–25 C to +85 C
–25 C to +85 C
SPECIFIED
RANGE
Clear plastic does not contain the structural-enhancing fillers
used in black plastic molding compound. As a result, clear
plastic is more sensitive to environmental stress than black
plastic. This can cause difficulties if devices have been stored
in high humidity prior to soldering. The rapid heating during
soldering can stress wire bonds and cause failures. Prior to
soldering, it is recommended that plastic devices be baked-out
at +85 C for 24 hours.
The fire-retardant fillers used in black plastic are not compat-
ible with clear molding compound. The OPT101 plastic
packages cannot meet flammability test, UL-94.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
AND SOLDERING
PACKAGE
MARKING
MOISTURE SENSITIVITY
ELECTROSTATIC
DISCHARGE SENSITIVITY
OPT101
OPT101
ORDERING
OPT101P-J
NUMBER
OPT101P
MEDIA, QUANTITY
TRANSPORT
Rail, 50
Rail, 50
OPT101
SBBS002A