PQ018EZ01ZP SHARP [Sharp Electrionic Components], PQ018EZ01ZP Datasheet - Page 19

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PQ018EZ01ZP

Manufacturer Part Number
PQ018EZ01ZP
Description
SC-63 Package, Low Voltage Operation Low Power-Loss Voltage Regulators
Manufacturer
SHARP [Sharp Electrionic Components]
Datasheets

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PQ018EZ01ZP
Manufacturer:
MIC
Quantity:
3 000
SHARP CORPORATION
7.5 For cleaning
(3) Hand soldering
(2) Dip soldering
Even within
there is the possibility
the wire in the device package
This device is basically
In case when hand soldering
it is recommended
of soldering
soldering
We recommend
In advance,
in order to avoid any soldering
(2) Ultrasonic
(3) Applicable
and 1 time only.
(a) Atter solder dip, please do cooling naturally.
(b) Please shall not give the mechanical
(1) Solvent cleaning
after thorough
In case when the other solvent is used, there are cases’&
the packaging
iron edge to leads directly
the above conditfons
iron edge temperature,
please confirm
cleaning
solvent
that solder dip should be 260F
Please obey the note items below concerning
that only one hand soldering
resin is eroded.
that the stress given to the terminals
con&nation
: Solvent
: Ethyl alcohol,
Immersion
designed
: The effect to device byL ultrasonic
by cleaning
output,
condition
and confirm
the ultrasonic
fully the dip soldering
cut.
is reluctantly
bridge.
temperature
regarding
for the soldering
In advance,
for 3 mm or less
cleaning
is performed
for 10s or less. Please be careful
etc. in order not to give any stress to the leads.
etc. Please test it in actual using condition
Please use the other solvent
bath size, ultrasonic
that doesn‘t occur any defect before starting
Methyl
stress or the impact
cleaning.
solder reflow, solder dip or hand soldering
needed for m-cation
time. PCB size or device mounting
45C or less
please con&m
alcohol,
in actual using condition.
or less (Solder temp.) within
should be done at 26O’c or less
such as reflow soldering
conditions
Isopropyl
by the deformation
power
cleaning
.
etc. in the actual
stress to the device.
fully at the actual application.
solder reflow.
alcohol
etc.,
differs
not to touch
.
i
p
or dip soldering.
10s
of PCB makes
application

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