MC9S08LL16_10 FREESCALE [Freescale Semiconductor, Inc], MC9S08LL16_10 Datasheet - Page 11

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MC9S08LL16_10

Manufacturer Part Number
MC9S08LL16_10
Description
MC9S08LL16 Series
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
3.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving
Freescale Semiconductor
I/O
T
P
P
P
JA
D
int
I/O
A
is neglected) is:
= Ambient temperature, C
= P
Equation 3-1
= Package thermal resistance, junction-to-ambient, C/W
= I
= Power dissipation on input and output pins — user determined
Thermal Characteristics
int
DD
SS
P
 V
or V
I/O
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
DD
Single-layer board
Four-layer board
DD
and
, Watts — chip internal power
I/O
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high
64-pin LQFP
48-pin QFN
48-pin LQFP
64-pin LQFP
48-pin QFN
48-pin LQFP
into account in power calculations, determine the difference between actual pin
Equation 3-2
 P
Rating
K = P
int
MC9S08LL16 Series MCU Data Sheet, Rev. 6
and can be neglected. An approximate relationship between P
Table 5. Thermal Characteristics
D
P
T
 (T
D
for K gives:
J
= K  (T
J
= T
) in C can be obtained from:
A
+ 273C) + 
A
+ (P
J
D
+ 273C)
 
Symbol
T
JA
T
JM
JA
JA
JA
A
)
 (P
D
)
2
SS
–40 to 85
T
Value
L
or V
95
72
84
81
54
30
57
to T
H
DD
will be very small.
C/W
C/W
Electrical Characteristics
Unit
C
C
D
Eqn. 3-1
Eqn. 3-2
Eqn. 3-3
and T
11
J

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