STR752FR1H7 STMICROELECTRONICS [STMicroelectronics], STR752FR1H7 Datasheet - Page 78

• Manufacturer Part Number: STR752FR1H7
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package characteristics
Figure 48. 100-ball low profile fine pitch ball grid array package
78/84
Figure 49. Recommended PCB design rules (0.80/0.75mm pitch BGA)
Dpad
Dsm
1.
Dim.
ddd
eee
A1
A2
A3
A4
D1
E1
fff
A
D
E
N
Values in inches are converted from mm and rounded to 4 decimal
digits.
b
e
F
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
0.270
0.45
9.85
9.85
Min
1.085
10.00
10.00
0.30
0.50
7.20
7.20
0.80
1.40
mm
Typ
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
Number of Balls
1.700
10.15
10.15
Max
0.80
0.55
0.12
0.15
0.08
100
0.0106
0.0177 0.0197 0.0217
0.3878 0.3937 0.3996
0.3878 0.3937 0.3996
Min
inches
0.0427
0.0118
0.2835
0.2835
0.0315
0.055
Typ
(1)
0.0669
0.0315
0.005
0.006
0.003
Max