HCS283DMSR INTERSIL [Intersil Corporation], HCS283DMSR Datasheet
HCS283DMSR
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HCS283DMSR Summary of contents
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... CMOS/SOS Logic Family. The HCS283MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS283DMSR HCS283KMSR HCS283D/Sample HCS283K/Sample HCS283HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...
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Functional Diagram CIN GND 16 VCC S0 4 HCS283MS COUT 10 9 518850 Spec Number ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay CIN to SO TPHL TPLH CIN to S1 TPHL TPLH CIN to S2, CO TPHL TPLH CIN to S3 TPHL TPLH An TPHL TPLH An ...
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TABLE 4. POSTIRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Supply Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = VIH = 4.5V, VOUT = 0.4V, VIL = 0V Output Current IOH VCC = VIH ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate group A inspection in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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Propagation Delay Timing Diagram VIH INPUT VS VSS TPLH VOH VS OUTPUT VOL VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems ...
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Die Characteristics DIE DIMENSIONS mils 2.21mm x 2.19mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...