HCS157D INTERSIL [Intersil Corporation], HCS157D Datasheet
HCS157D
Related parts for HCS157D
HCS157D Summary of contents
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... The HCS157MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS157DMSR HCS157KMSR HCS157D/Sample HCS157K/Sample HCS157HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCS157MS Pinouts ...
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Functional Block Diagram 4I1 14 4I0 10 3I1 11 3I0 6 2I1 5 2I0 3 1I1 2 1I0 ENABLE High Level L = Low Level X = ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay TPHL VCC = 4.5V Data to Output TPLH VCC = 4.5V Propagation Delay TPHL VCC = 4.5V Enable to Output TPLH VCC = 4.5V Propagation Delay TPHL VCC = 4.5V ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Supply Current ICC Output Current (Sink) IOL Output Current IOH (Source) Output Voltage Low VOL Output Voltage High VOH Input Leakage Current IIN Noise Immunity FN Functional Test Propagation Delay ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate Group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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Propagation Delay Timing Diagram and Load Circuit VIH INPUT VS VSS TPLH VOH VS OUTPUT VOL TEST DUT POINT CL RL All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by ...
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Die Characteristics DIE DIMENSIONS mils METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND PAD SIZE: 100 ...