HCS125D INTERSIL [Intersil Corporation], HCS125D Datasheet
HCS125D
Related parts for HCS125D
HCS125D Summary of contents
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... HCS125DMSR - +125 C Intersil Class S Equivalent o o HCS125KMSR - +125 C Intersil Class S Equivalent o HCS125D/ +25 C Sample Sample o HCS125K/ +25 C Sample Sample o HCS125HMSR +25 C Die CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 ...
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Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay TPHL VCC = 4.5V, VIH = 4.5V, Input to Y TPLH VIL = 0V Enable Delay TPZL VCC = 4.5V, VIH = 4.5V, OE toY TPZH VIL = 0V Disable ...
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TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Output Voltage High VOH VCC = 5.5V, VIH = 3.85V, VIL = 1.65V, IOH = -50 A VCC = 4.5V, VIH = 3.15V, VIL = 1.35V, IOH = -50 A ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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Propagation Delay Timing Diagram VIH INPUT VS VSS TPLH VOH VS OUTPUT VOL Transition Timing Diagram TTLH VOH 80% 20% OUTPUT VOL VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 Three-State High Timing Diagrams ...
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Three-State Low Timing Diagrams VIH INPUT VS VSS TPZL VOZ VT OUTPUT VOL THREE-STATE LOW VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VT 2.25 VW 0.90 GND 0 HCS125MS Three-State Low Load Circuit TPLZ VW UNITS V ...
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Die Characteristics DIE DIMENSIONS 91(mils) 2.34 x 2.31 (mm) METALLIZATION: Type: AlSi Å Å Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND PAD ...