TC9491ACZM TELCOM [TelCom Semiconductor, Inc], TC9491ACZM Datasheet - Page 2

• Manufacturer Part Number: TC9491ACZM
• Description: LOW POWER, BANDGAP VOLTAGE REFERENCES
• Manufacturer: TELCOM [TelCom Semiconductor, Inc]

ELECTRICAL CHARACTERISTICS:
Symbol
V
I
Z
S
3-16
TC9491A
TC9491B
ABSOLUTE MAXIMUM RATINGS*
Forward Current .................................................... +10mA
Reverse Current .................................................... +30mA
Storage Temperature Range ................ – 65 C to +150 C
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Power Dissipation
*Functional operation above the absolute maximum stress ratings is not
implied.
RMIN
V
V
(BR)R
(BR)R
(BR)
TO-92 Package ..................................... 0 C to +70 C
COA Surface Mount Package ............... 0 C to +70 C
TO-92 Package .............................................. +300 C
COA Surface Mount Package ........................ +300 C
Limited by Forward/Reverse Current
/ T Average Temperature Coefficient
Parameter
Reverse Breakdown Voltage
T
Minimum Operating Current
T
T
Reverse Breakdown Voltage
Change with Current
I
T
1.0mA = I
T
Reverse Dynamic Impedance
Long Term Stability
Rmin
A
A
A
A
A
= 0 C to +70 C
= +25 C
= 0 C to +70 C
= 0 C to +70 C
= 0 C to +70 C
= I
R
= 1.0mA, T
R
= 20mA, T
A
A
= +25 C
= +25 C
Test Conditions
I
I
10 A = I
I
T
R
R
R
A
= 100 A
= 100 A,
= +25 C 0.1 C
T
20mA
A
= +25 C, unless otherwise specified.
R
= 20mA
RESPONSE TIME TEST CIRCUIT
1.200
1.180
Min
—
—
—
—
—
—
—
—
—
TC9491A
Typ
1.22
8.0
0.6
20
—
—
—
—
—
—
—
INPUT
1.250
1.290
Max
1.0
1.5
15
20
10
20
50
—
—
36 k
LOW POWER, BANDGAP
VOLTAGE REFERENCES
TELCOM SEMICONDUCTOR, INC.
1.200
1.219
Min
—
—
—
—
—
—
—
—
—
TC9491B
1.220
Typ
8.0
0.6
20
—
—
—
—
—
—
—
TC9491
OUTPUT
1.250
1.260
Max
100
1.0
1.5
15
20
20
25
—
—
ppm/kHR
Unit
ppm/ C
mV
V
A