TPS851_07 TOSHIBA [Toshiba Semiconductor], TPS851_07 Datasheet - Page 5

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TPS851_07

Manufacturer Part Number
TPS851_07
Description
Silicon Epitaxial Planar
Manufacturer
TOSHIBA [Toshiba Semiconductor]
Datasheet
Packing Specification
(2)
(3)
(1)
(2)
Recommended soldering pattern
Cleaning conditions
Packing quantity
Packing format
When cleaning is required after soldering
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
Carton specification
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or 30°C × 3 minutes
Ultrasonic cleaning: 300 W or less
Carton dimensions
Reel (minimum packing quantity)
(W) 81 mm × (L) 280 mm × (H) 280 mm
Carton
0.65
0.65
5
0.4
5 reels (15,000 devices)
Label
3,000 devices
Unit: mm
2007-10-01
TPS851

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