BH6173GUL_11 ROHM [Rohm], BH6173GUL_11 Datasheet - Page 4

• Manufacturer Part Number: BH6173GUL_11
• Description: Silicon Monolithic Integrated Circuit
• Manufacturer: ROHM [Rohm]

(1) Absolute maximum ratings
(2) Recommended operating range
(3) Reverse connection of power supply connector
(4) Power supply lines
(5) GND voltage
(6) Shorts between pins and misinstallation
(7) Operation in strong magnetic fields
(8) Inspection in set board
(9) Input pins
(10) Ground wiring pattern
(11) Externally attached capacitors
(12) Thermal shutdown circuit (TSD)
(13) Thermal design
(14) Rush Current
Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed, consider applying
fuses or other physical safety measures.
conditions for each parameter. Even when these are within the recommended operating range, voltage and temperature characteristics are indicated.
placing a diode between the power supply and the power supply pin of the LSI.
pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. Similarly take pattern design into account for
GND lines as well.
determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for various characteristics of the capacitors used.
becomes less than a GND by actually including transition phenomena.
damage. There also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or GND.
process. Moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove
it after turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in
transport and storage.
operation and may be the cause of malfunctions as well as damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other
ways such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the LSI. Furthermore,
when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical
characteristics.
provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause
the small signal GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.
capacitance change due to factors such as temperature.
aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI
with this circuit operating or use the LSI assuming its operation.
●Use-related Cautions
power line when powering-up a LSI which is equipped with several power supplies, depending on on/off sequence, and ramp delays.
If applied voltage (VBAT1, VBAT2, PBAT, , VIO), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is a risk of damage.
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is those that are guaranteed under the
There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection, take measures such as externally
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply
Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using electrolytic capacitors,
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that there are no pins for which the potential
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed erroneously, there is a risk of LSI
When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low impedance LSI pins, be sure to discharge for each
Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate, they give rise to interference with circuit
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern and small signal GND pattern and
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to DC bias and
When the junction temperature reaches the defined value, the thermal shutdown circuit operates and turns the switch OFF. The thermal shutdown circuit, which is
In the design of the board pattern, make power supply and GND line wiring low impedance.
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.
Extra care must be taken on power coupling, power, ground line impedance, and PCB design while excess amount of rush current might instantly flow through the
Be careful when using the LSI in a strong magnetic field, since it may malfunction.
REV. B
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