SA56004ATK NXP [NXP Semiconductors], SA56004ATK Datasheet - Page 32

• Manufacturer Part Number: SA56004ATK
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
15. Mounting
SA56004X_5
Product data sheet
15.1 Printed-circuit board layout considerations
Table 21.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Care must be taken in Printed-Circuit Board (PCB) layout to minimize noise induced at the
remote temperature sensor inputs, especially in extremely noisy environments, such as a
computer motherboard. Noise induced in the traces running between the device sensor
inputs and the remote diode can cause temperature conversion errors. Typical sensor
signal levels to the SA56004X is a few microvolts. The following guidelines are
recommended:
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
1. Place the SA56004X as close as possible to the remote sensor. It can be from
Fig 24. Temperature profiles for large and small components
4 inches to 8 inches, as long as the worst noise sources such as clock generator, data
and address buses, CRTs are avoided.
temperature
MSL: Moisture Sensitivity Level
Lead-free process (from J-STD-020C)
Figure
24.
Rev. 05 — 22 May 2008
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
Digital temperature sensor with overtemperature alarms
minimum peak temperature
= MSL limit, damage level
3
)
350 to 2000
260
250
245
temperature
peak
SA56004X
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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