HIP6601_04 INTERSIL [Intersil Corporation], HIP6601_04 Datasheet - Page 8

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HIP6601_04

Manufacturer Part Number
HIP6601_04
Description
Synchronous-Rectified Buck MOSFET Drivers
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
Small Outline Plastic Packages (SOIC)
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
are not necessarily exact.
2
-A-
INDEX
AREA
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
3
e
B
D
M
C A
For information regarding Intersil Corporation and its products, see web site www.intersil.com
SEATING PLANE
M
-C-
E
-B-
B S
A
H
A1
8
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
HIP6601, HIP6603
C
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-012-AA ISSUE C)
0.0532
0.0040
0.013
0.0075
0.1890
0.1497
0.2284
0.0099
0.016
MIN
0
0.050 BSC
o
INCHES
8
MAX
0.0688
0.0098
0.020
0.0098
0.1968
0.1574
0.2440
0.0196
0.050
8
o
MILLIMETERS
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
MIN
0
o
1.27 BSC
8
MAX
1.75
0.25
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8
o
Rev. 0 12/93
NOTES
9
3
4
5
6
7
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