HIP6201 INTERSIL [Intersil Corporation], HIP6201 Datasheet - Page 9

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HIP6201

Manufacturer Part Number
HIP6201
Description
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
Layout Considerations
Example Layout
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
• HIP6200 located near bulk output capacitance (not shown is the microprocessor load itself - for best performance, the
• C
• Solid ground and V
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
HIP6200 and bulk output capacitance should be located close to the P)
37
(+5V bulk cap) located near the HIP6200
TOP - SILK SCREEN
(OUTPUT INDUCTOR)
INTERNAL ONE
OUTPUT OF DC-DC
BULK OUTPUT CAPACITANCE
OF DC-DC CONVERTER
OUT
FROM P CORE
2-449
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planes with numerous via interconnects
V
RTN
OUT
+
NOTE: Internal layers are shown as negatives
(white is copper):
C
5x
100
10V
19-23
via connection to copper plane
no connection
FIGURE 6. TYPICAL SCHEMATIC
HIP6200, HIP6201
TOP - COMPONENT SIDE
C
3x
1
16V
24-26
CERAMIC DECOUPLING
FOR HIGH di/dt LOAD
(MAY NOT BE REQUIRED)
100
10V
C
37
+
1
7
6
P
OUT
SNS
PGND
VCC
HIP6201
2
V
U3
CC
4
GND
CAP
EN
3
8
5
C
8200p
SOLDER SIDE
39
GND
C
0.1
38
P5V
RTN

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