LT3757 LINER [Linear Technology], LT3757 Datasheet - Page 33

• Manufacturer Part Number: LT3757
• Description: Boost, Flyback, SEPIC and Inverting Controller
• Manufacturer: LINER [Linear Technology]

package DescripTion
3.55 0.05
2.15 0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
0.25 0.05
1.65 0.05
(2 SIDES)
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(Reference LTC DWG # 05-08-1699 Rev B)
10-Lead Plastic DFN (3mm × 3mm)
2.38 0.05
(2 SIDES)
0.50
BSC
DD Package
0.75 0.05
3.00 0.10
0.70 0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.125
6
2.38 0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 0.05
0.40 0.10
(DD) DFN REV B 0309
LT3757

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