LM2614ATLX NSC [National Semiconductor], LM2614ATLX Datasheet - Page 4

• Manufacturer Part Number: LM2614ATLX
• Description: 400mA Sub-Miniature Adjustable DC-DC Converter Optimized for RF Power Amplifiers
• Manufacturer: NSC [National Semiconductor]

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V
V
V
I
I
I
R
R
R
I
V
V
F
F
T
SHDN
Q1_PWM
Q2_PFM
LIM
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
Specifications with standard typeface are for T
perature Range of T
SYNC
OSC
min
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but device specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and Conditions
in the Electrical Characteristics table. Typical (typ) specifications are mean or average values at 25˚C and are not guaranteed.
Note 2: Thermal shutdown will occur if the junction temperature exceeds 150˚C.
Note 3: Thermal resistance specified with 2 layer PCB (0.5/0.5 oz. cu).
Note 4: The LM2614 is designed for mobile phone applications where turn-on after system power-up is controlled by the system controller. Thus, it should be kept
in shutdown by holding the EN pin low until the input voltage exceeds 2.8V.
Note 5: The hysteresis voltage is the minimum voltage swing on the FB pin that causes the internal feedback and control circuitry to turn the internal PFET switch
on and then off during PFM mode. When resistor dividers are used like in the operating circuit of Figure 4, the hysteresis at the output will be the value of the
hysteresis at the feedback pin times the resistor divider ratio. In this case, 24mV (typ) x ((46.4k + 33.2k)/33.2k).
Note 6: Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the voltage at the FB pin is pulled below 0.7V, the internal PFET switch
turns off for 2.5µs to allow the inductor current to diminish.
Note 7: SYNC driven with an external clock switching between V
the external clock frequency. The LM2614 synchronizes to the rising edge of the external clock.
IN
FB
HYST
DSON (P)
DSON (N)
DSON (TC)
IH
IL
PVIN, VDD to SGND
PGND to SGND, PVIN to VDD
EN, EAOUT, EANEG, SYNC/MODE
to SGND
FB, SW
Symbol
Input Voltage Range
Feedback Voltage
PFM Comparator Hysteresis
Voltage
Shutdown Supply Current
DC Bias Current into VDD
Pin-Pin Resistance for
P FET
Pin-Pin Resistance for
N FET
FET Resistance
Temperature Coefficient
Switch Peak Current Limit
(Note 6)
Logic High Input, EN,
SYNC/MODE
Logic Low Input, EN,
SYNC/MODE
SYNC/MODE Clock
Frequency Range
Internal Oscillator
Frequency
Minimum ON-Time of PFET
Switch in PWM Mode
A
= T
Parameter
J
= −25˚C to +85˚C. Unless otherwise specified, PVIN = VDD = EN = SYNC/MODE = 3.6V.
(GND −0.2V) to
−0.2V to +0.2V
−0.2V to +6V
−0.2V to +6V
(VDD +0.2V)
PVIN = VDD = V
PFM Mode (SYNC/MODE =
0V) (Note 5)
VIN = 3.6V, EN = 0V
SYNC/MODE = VIN
FB = 2V
SYNC/MODE = 0V
FB = 2V
LM2614ATL
LM2614BTL
(Note 7)
LM2614ATL, PWM Mode
LM2614BTL, PWM Mode
A
(Note 1)
= T
IN
J
and GND. When an external clock is present at SYNC; the IC is forced to be in PWM mode at
= 25˚C, and those in boldface type apply over the full Operating Tem-
Conditions
4
IN
(Note 4)
Storage Temperature Range
Lead Temperature
(Soldering, 10 sec.)
Junction Temperature (Note 2)
Minimum ESD Rating
(Human Body Model, C = 100 pF, R = 1.5 kΩ)
Thermal Resistance (θ
1.485
Min
510
400
500
468
450
2.8
0.4
JA
) (Note 3)
1.50
0.02
0.95
0.80
Typ
600
160
395
330
690
690
600
600
200
3.6
0.5
24
1.515
1000
Max
−45˚C to +150˚C
−25˚C to +125˚C
725
195
550
500
850
980
732
750
5.5
1.3
3
140˚C/W
260˚C
±
Units
2 kV
%/C
kHz
kHz
mV
mΩ
mΩ
mA
µA
µA
µA
ns
V
V
V
V