BD6086GU_11 ROHM [Rohm], BD6086GU_11 Datasheet - Page 78

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BD6086GU_11

Manufacturer Part Number
BD6086GU_11
Description
13LEDs ALC* Flash and Illumination
Manufacturer
ROHM [Rohm]
Datasheet
● Notes for use
© 2011 ROHM Co., Ltd. All rights reserved.
www.rohm.com
BD6086GU
(10) LDO
(11) About the pin for the test, the un-use pin
(12) Rush Current
(13) About the function description or application note or more.
(1) Absolute Maximum Ratings
(2) Power supply and ground line
(3) Ground voltage
(4) Short circuit between pins and erroneous mounting
(5) Operation in strong electromagnetic field
(6) Input pins
(7) External capacitor
(8) Thermal shutdown circuit (TSD)
(9) Thermal design
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies and ground
lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the
external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor
between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure
the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric
transient.
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between
the pin and the power supply or the ground pin, the ICs can break down.
Be noted that using ICs in the strong electromagnetic field can malfunction them.
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage
lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the
input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied,
apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical
characteristics.
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or
higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at
isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI.
Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation.
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because
it has the possibility that an operation becomes unstable.
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a
function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our
company person in charge.
Rush current may flow in instant in the internal logic unfixed state by the power supply injection order and delay.
Therefore, be careful of power supply coupling capacity, a power supply and the width of grand pattern wiring, and
leading about.
The function manual and the application notebook are the design materials to design a set. So, the contents of the
materials aren't always guaranteed. Please design application by having fully examination and evaluation include the
external elements.
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Technical Note
2011.04 - Rev.A

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