X28HC256DI-12 INTERSIL [Intersil Corporation], X28HC256DI-12 Datasheet - Page 3

• Manufacturer Part Number: X28HC256DI-12
• Description: 5 Volt, Byte Alterable EEPROM
• Manufacturer: INTERSIL [Intersil Corporation]

Ordering Information
*Add "T1" suffix for tape and reel.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X28HC256S-12*
X28HC256SZ-12 (Note)
X28HC256SI-12*
X28HC256SIZ-12 (Note)
X28HC256SM-12*
X28HC256D-90
X28HC256DI-90
X28HC256DM-90
X28HC256DMB-90
X28HC256EM-90
X28HC256EMB-90
X28HC256FI-90
X28HC256FM-90
X28HC256FMB-90
X28HC256J-90*
X28HC256JZ-90* (Note)
X28HC256JI-90*
X28HC256JIZ-90* (Note)
X28HC256JM-90*
X28HC256KM-90
X28HC256KMB-90
X28HC256P-90
X28HC256PZ-90 (Note)
X28HC256PI-90
X28HC256PIZ-90 (Note)
X28HC256S-90*
X28HC256SI-90*
X28HC256SIZ-90 (Note)
X28HC256DMB-70
X28HC256JI-20
X28HC256SI-20T1
PART NUMBER
X28HC256S-12
X28HC256S-12 Z
X28HC256SI-12
X28HC256SI-12 Z
X28HC256SM-12
X28HC256D-90
X28HC256DI-90
X28HC256DM-90
X28HC256DMB-90
X28HC256EM-90
X28HC256EMB-90
X28HC256FI-90
X28HC256FM-90
X28HC256FMB-90
X28HC256J-90
X28HC256J-90 Z
X28HC256JI-90
X28HC256JI-90 Z
X28HC256JM-90
X28HC256KM-90
X28HC256KMB-90
X28HC256P-90
X28HC256P-90 Z
X28HC256PI-90
X28HC256PI-90 Z
X28HC256S-90
X28HC256SI-90
X28HC256SI-90 Z
X28HC256DMB-70
X28HC256JI-20
PART MARKING
3
(Continued)
ACCESS TIME
(ns)
120
200
200
90
70
X28HC256
TEMP. RANGE
MIL-STD-883
MIL-STD-883
MIL-STD-883
MIL-STD-883
MIL-STD-883
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils) (Pb-free)
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils) (Pb-free)
28 Ld SOIC (300 mils)
28 Ld CERDIP (520 mils)
28 Ld CERDIP (520 mils)
28 Ld CERDIP (520 mils)
28 Ld CERDIP (520 mils)
32 Ld LCC (458 mils)
32 Ld LCC (458 mils)
28 Ld FLATPACK (440 mils)
28 Ld FLATPACK (440 mils)
28 Ld FLATPACK (440 mils)
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC
28 Ld PGA
28 Ld PGA
28 Ld PDIP
28 Ld PDIP (Pb-free)**
28 Ld PDIP
28 Ld PDIP (Pb-free)**
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils) (Pb-free)
28 Ld CERDIP (520 mils)
32 Ld PLCC
28 Ld SOIC (300 mils) Tape and Reel
PACKAGE
MDP0027
MDP0027
MDP0027
MDP0027
MDP0027
N32.45x55
N32.45x55
N32.45x55
N32.45x55
N32.45x55
G28.550x650A
G28.550x650A
E28.6
E28.6
E28.6
E28.6
MDP0027
MDP0027
MDP0027
N32.45x55
MDP0027
PKG. DWG. #
May 17, 2006
FN8108.1