M24M01-HRCS3G/A STMICROELECTRONICS [STMicroelectronics], M24M01-HRCS3G/A Datasheet - Page 30

• Manufacturer Part Number: M24M01-HRCS3G/A
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24M01-R die description
8
Caution:
30/37
M24M01-R die description
As EEPROM cells loose their charge (and so their binary value) when exposed to ultra violet
(UV) light, EEPROM dice delivered in wafer form by STMicroelectronics must never be
exposed to UV light.
Product M24M01-A
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Die Layout
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Figure 17. M24M01-R die plot
1. Refer to
Wafer size
Die identification
Die size (X × Y)
Scribe line
Pad opening
DI
Pads
Table 18: Pad coordinates
V
E0
E1
E2
SS
203 mm (8 inches)
M24M01, processed in the Rousset fab
2085 × 3605 µm (including scribe line)
80.0 × 80.0 µm
90 × 90 µm
Die identification (at the position shown in
Pad contacts (at the positions shown in
Table
Doc ID 12943 Rev 7
Die identification: M24M01
for the pad locations.
18)
Y
M24M01-R, M24M01-W, M24M01-HR
V CC
X
WC
SCL
SDA
Figure 17
Figure
17)
and
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