M95512-D-RCS3G/AB STMICROELECTRONICS [STMicroelectronics], M95512-D-RCS3G/AB Datasheet - Page 40

• Manufacturer Part Number: M95512-D-RCS3G/AB
• Description: 512 Kbit serial SPI bus EEPROM with high-speed clock
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package mechanical data
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Figure 24. TSSOP8 – 8 lead thin shrink small outline, package outline
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be
Table 20.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
connected to any other voltage or signal line on the PCB, for example during the soldering process.
CP
A1
A2
E1
L1
A
D
E
N
b
e
L

c
TSSOP8 – 8 lead thin shrink small outline, package mechanical data
CP
A
1.000
3.000
0.650
6.400
4.400
0.600
1.000
Typ
8
1
b
D
millimeters
Doc ID 11124 Rev 13
0.050
0.800
0.190
0.090
2.900
6.200
4.300
0.450
Min
5
4
0°
–
8
e
E1
A2
E
1.200
0.150
1.050
0.300
0.200
0.100
3.100
6.600
4.500
0.750
Max
8°
–
0.0394
0.1181
0.2520
0.1732
0.0236
0.0256
0.0394
Typ
A1
L1
L
inches
M95512-W, M95512-R
0.0020
0.0315
0.0075
0.0035
0.1142
0.2441
0.1693
0.0177
TSSOP8AM
Min
0°
–
8
(1)
c
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
0.2598
0.1772
0.0295
Max
8°
–