AT24C04B ATMEL [ATMEL Corporation], AT24C04B Datasheet

no-image

AT24C04B

Manufacturer Part Number
AT24C04B
Description
Two-wire Serial EEPROM 4K (512 x 8) 8K (1024 x 8)
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C04B-PU
Manufacturer:
AT
Quantity:
20 000
Part Number:
AT24C04B-TH-T
Manufacturer:
Atmel
Quantity:
40
Part Number:
AT24C04B-TH-T
Manufacturer:
ATMEL
Quantity:
5 000
Part Number:
AT24C04BN-SH-B
Manufacturer:
ATMEL
Quantity:
5
Part Number:
AT24C04BN-SH-B
Quantity:
250
Part Number:
AT24C04BN-SH-T
Manufacturer:
ATMEL
Quantity:
40
Part Number:
AT24C04BN-SH-T
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Note:
4K: The software A2 and A1 bits in the device
address word must be set to zero to properly
communicate.
8K: The software A2 bit in the device address word
must be set to zero to properly communicate.
Features
Description
The AT24C04B/08B provides 4096/8192 bits of serial electrically erasable and pro-
grammable read-only memory (EEPROM) organized as 512/1024 words of 8 bits
each. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operation are essential. The AT24C04B/08B is
available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini-
MAP (MLP 2x3)
accessed via a Two-wire serial interface. In addition, the AT24C04B/08B is available
in 1.8V (1.8V to 5.5V) version.
Table 0-1.
Pin Name
A0 - A2
SDA
SCL
WP
NC
GND
VCC
Low-voltage and Standard-voltage Operation
Internally Organized 512 x 8 (4K), or 1024 x 8 (8K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility
Write Protect Pin for Hardware Data Protection
16-byte Page (4K, 8K) Write Modes
Partial Page Writes Allowed
Self-timed Write Cycle (5 ms max)
High-reliability
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini-MAP (MLP 2x3), 5-lead SOT23,
8-lead TSSOP and 8-ball dBGA2 Packages
Lead-free/Halogen-free
Die Sales: Wafer Form, Tape and Reel and Bumped Wafers
– 1.8 (V
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
For use of 5-lead SOT23
CC
Address Inputs
Serial Data
Serial Clock Input
Write Protect
No Connect
Ground
Function
Power Supply
= 1.8V to 5.5V)
Pin Configuration
,
5-lead SOT23, 8-lead TSSOP, and 8-ball dBGA2 packages and is
GND
SDA
SCL
Mini-MAP (MLP 2x3)
GND
8-lead Ultra-Thin
VCC
SDA
A0
A1
A2
SCL
WP
8-lead TSSOP
5-lead SOT23
Bottom View
1
2
3
8
7
6
5
1
2
3
4
1
2
3
4
8
7
6
5
5
4
A0
A1
A2
GND
VCC
WP
SCL
SDA
WP
VCC
GND
GND
A0
A1
A2
VCC
SDA
SCL
A0
A1
A2
WP
8-ball dBGA2
Bottom View
8-lead SOIC
8-lead PDIP
1
2
3
4
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
8
7
6
5
A0
A1
A2
GND
VCC
WP
SCL
SDA
VCC
WP
SCL
SDA
Two-wire
Serial EEPROM
4K (512 x 8)
8K (1024 x 8)
AT24C04B
AT24C08B
5226D–SEEPR–7/08

Related parts for AT24C04B

AT24C04B Summary of contents

Page 1

... The AT24C04B/08B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini- MAP (MLP 2x3) 5-lead SOT23, 8-lead TSSOP, and 8-ball dBGA2 packages and is , accessed via a Two-wire serial interface. In addition, the AT24C04B/08B is available in 1.8V (1.8V to 5.5V) version. Table 0-1. Pin Configuration Pin Name ...

Page 2

... Storage Temperature .....................................–65°C to +150°C Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Figure 0-1. Block Diagram VCC GND WP SCL SDA AT24C04B/08B 2 *NOTICE: START STOP LOGIC SERIAL CONTROL LOGIC LOAD COMP DEVICE ADDRESS LOAD INC COMPARATOR R/W DATA WORD ...

Page 3

... DEVICE/PAGE ADDRESSES (A2, A1, A0): The AT24C04B uses the A2 and A1 inputs for hard wire addressing and a toal of four 4K devices may be addressed on a single bus system. The A0 pin connect and can be connected to ground (device addressing is discussed in detail under the Device Addressing section). ...

Page 4

... Memory Organization AT24C04B, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires an 9-bit data word address for random word addressing. AT24C08B, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit data word address for random word addressing. ...

Page 5

... This parameter is ensured by characterization only. 5226D–SEEPR–7/08 = 40°C to +85° +1.8V to +5.5V TTL Gate and – 1.8, 2.5, 2.7 Min Max 400 1.2 0.6 50 0.1 0.9 1.2 0.6 0.6 0 100 0.3 300 0 AT24C04B/08B 5.0-volt Min Max Units 1000 kHz 0.4 µs 0.4 µ 0.05 0.55 µs 0.5 µs 0.25 µs 0.25 µs 0 µs 100 ns 0.3 µs ...

Page 6

... EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The AT24C04B/08B features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations ...

Page 7

... The write cycle time t is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. WR 5226D–SEEPR–7/08 ® t HIGH LOW LOW t t HD.STA HD.DAT t AA ACK t wr STOP CONDITION AT24C04B/08B SU.DAT t DH (1) START CONDITION t SU.STO t BUF 7 ...

Page 8

... Figure 5-2. Data Validity SDA SCL Figure 5-3. Start and Stop Definition SDA SCL Figure 5-4. Output Acknowledge SCL DATA IN DATA OUT AT24C04B/08B 8 DATA STABLE DATA STABLE DATA CHANGE START 1 START STOP 8 9 ACKNOWLEDGE 5226D–SEEPR–7/08 ...

Page 9

... The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. 5226D–SEEPR–7/08 Figure , to the nonvolatile memory. All inputs are disabled during this WR Figure 8-3 on page AT24C04B/08B 8-1). Figure 8-2 on page 11). 9 ...

Page 10

... The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 8-1. Device Address AT24C04B/08B 10 Figure 8-5 on page 11). Figure 8-6 on page Figure 8-4 on 12) ...

Page 11

... Figure 8-2. Byte Write Figure 8-3. Page Write Figure 8-4. Current Address Read Figure 8-5. Random Read 5226D–SEEPR–7/08 AT24C04B/08B 11 ...

Page 12

... Figure 8-6. Sequential Read AT24C04B/08B 12 5226D–SEEPR–7/08 ...

Page 13

... AT24C04B Ordering Information Ordering Code AT24C04B-PU (Bulk form only) (1) AT24C04BN-SH-B (NiPdAu Lead Finish) (2) AT24C04BN-SH-T (NiPdAu Lead Finish) (1) AT24C04B-TH-B (NiPdAu Lead Finish) (2) AT24C04B-TH-T (NiPdAu Lead Finish) (2) AT24C04BY6-YH-T (NiPdAu Lead Finish) (2) AT24C04B-TSU-T (2) AT24C04BU3-UU-T (3) AT24C04B-W-11 Notes: 1. “-B” denotes bulk. 2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel. ...

Page 14

... Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8Y6 8-lead, 2 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm) 5TS1 5-lead, 2. 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23) 8U3-1 8-ball, die Ball Grid Array Package (dBGA2) –1.8 Low-voltage (1.8V to 5.5V) AT24C04B/08B 14 Voltage Package 1.8 8P3 1.8 8S1 1.8 8S1 1 ...

Page 15

... Seal Year Y = SEAL YEAR | Seal Week 6: 2006 | | | 7: 2007 8: 2008 2009 Lot Number to Use ALL Characters in Marking BOTTOM MARK AT24C04B/08B WW = SEAL WEEK 0: 2010 02 = Week 2 1: 2011 04 = Week 4 2: 2012 :: : :::: : 3: 2013 :: : :::: :: 50 = Week Week 52 No Bottom Mark WW = SEAL WEEK 0: 2010 02 = Week 2 ...

Page 16

... Thin Mini MAP TOP MARK |---|---|---| |---|---|---| H 1 |---|---|---| |---|---|---| * | Pin 1 Indicator (Dot) AT24C04B/08B SEAL YEAR 6: 2006 7: 2007 W 8: 2008 9: 2009 YEAR OF ASSEMBLY XX = ATMEL LOT NUMBER TO COORESPOND WITH NSEB TRACE CODE LOG BOOK. (e. AA, AB, AC,...AX, AY, AZ SEAL YEAR 6: 2006 ...

Page 17

... BOTTOM MARK |---|---|---|---| Y |---|---|---|---| Y = One Digit Year Code M = Seal Month (Use Alpha Designator A- Trace Code dBGA2 9.7 TOP MARK 5226D–SEEPR–7/08 |---|---|---| |---|---|---| |---|---|---| * | Pin 1 Indicator (Dot 2008 = 7 Etc NSEB TRACE CODE LOG BOOK. |---|---|---|---|---| 4 B |---|---|---|---|---| * | Pin 1 Indicator (Dot AT24C04B/08B = ...

Page 18

... LINE 1-------> LINE 2-------> XXX = Device U = Material Set Y = One Digit Year Code M = Seal Month (Use Alpha Designator A- Trace Code AT24C04B/08B 18 04BU YMTC |<-- Pin 1 This Corner 5226D–SEEPR–7/08 ...

Page 19

... Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 2325 Orchard Parkway San Jose, CA 95131 R 5226D–SEEPR–7/ TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) AT24C04B/08B End View COMMON DIMENSIONS (Unit of Measure = inches) SYMBOL MIN NOM MAX A 0.210 – – A2 ...

Page 20

... JEDEC SOIC Top View e Side View Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT24C04B/08B TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing ...

Page 21

... Dimension D and determined at Datum Plane H. 2325 Orchard Parkway San Jose, CA 95131 R 5226D–SEEPR–7/ TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) AT24C04B/08B L1 L End View COMMON DIMENSIONS (Unit of Measure = mm) MIN MAX SYMBOL NOM D 2.90 3.00 3 ...

Page 22

... Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad soldered it should be tied to ground 2325 Orchard Parkway San Jose, CA 95131 R AT24C04B/08B 22 A Pin 1 Pin 1 Index ...

Page 23

... E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R 5226D–SEEPR–7/ Top View Side View TITLE 5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SHRINK SOT) AT24C04B/08B End View COMMON DIMENSIONS (Unit of Measure = mm) MIN SYMBOL NOM A – – A1 0.00 – ...

Page 24

... Bottom View 8 SOLDER BALLS 1. Dimension “b” is measured at the maximum solder ball diameter. This drawing is for general information only. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT24C04B/08B TITLE 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch, Small Die Ball Grid Array Package (dBGA2) 1 ...

Page 25

... Revision History Doc. Rev. 5226D 5226C 5226B 5226A 5226D–SEEPR–7/08 Date Comments 7/2008 Removed ‘Preliminary’ status 2/2008 Text changes on page 4 and 9 Updated to new template 8/2007 Updated common Figures Added Package Marking tables 6/2007 Initial document release AT24C04B/08B 25 ...

Page 26

Headquarters Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to ...

Related keywords