25AA010A-E/MC MICROCHIP [Microchip Technology], 25AA010A-E/MC Datasheet - Page 20

• Manufacturer Part Number: 25AA010A-E/MC
• Description: 1K SPI Bus Serial EEPROM
• Manufacturer: MICROCHIP [Microchip Technology]

25AA010A/25LC010A
8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
DS21832C-page 20
JEDEC Equivalent MO-229 VCED-2
DWG No. C04-123
REF: Reference Dimension, usually without tolerance, for information purposes only.
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad may vary according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
* Controlling Parameter
** Not within JEDEC parameters
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Length §
Contact-to-Exposed Pad
Contact Width
See ASME Y14.5M
See ASME Y14.5M
ID INDEX
(NOTE 1)
A3
AREA
PIN 1
Dimension Limits
TOP VIEW
D
§
Units
D2
E2
A3
A1
n
D
E
L
K
b
e
A
E
MIN
A1
.000
.059
.012
.008
.008
Preliminary
.031
.051
CONFIGURATION
A
ALTERNATE
DETAIL
CONTACT
.008 REF.
.020 BSC
.079 BSC
.118 BSC
INCHES
NOM
EXPOSED
.035
.016
.010
.001
(NOTE 2)
METAL
–
–
–
8
EXPOSED
K
(NOTE 3)
PAD
TIE BAR
MAX
.039
.002
.069
.075
.020
.012
BOTTOM VIEW
b
–
MIN
1.30**
1.50**
D2
0.80
0.00
0.30
0.20
0.20
2
MILLIMETERS*
p
© 2006 Microchip Technology Inc.
0.20 REF.
1
0.50 BSC
2.00 BSC
3.00 BSC
Revised 09-12-05
n
NOM
0.90
0.02
0.40
0.25
E2
–
–
–
8
L
MAX
1.00
0.05
1.75
1.90
0.50
0.30
–