24LCS52-/MC MICROCHIP [Microchip Technology], 24LCS52-/MC Datasheet
24LCS52-/MC
Related parts for 24LCS52-/MC
24LCS52-/MC Summary of contents
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... I C™ compatible • Schmitt Trigger inputs for noise suppression • Output slope control to eliminate ground bounce • 100 kHz (24AA52) and 400 kHz (24LCS52) compatibility • Self-timed write cycle (including auto-erase) • Page write buffer for bytes • ...
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... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...
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... This eliminates the need for This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com. © 2005 Microchip Technology Inc. 24AA52/24LCS52 V = +1.8V to +5.5V CC Industrial (I -40° ...
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... FIGURE 1-1: BUS TIMING DATA 5 3 SCL 7 6 SDA 14 IN SDA OUT FIGURE 1-2: BUS TIMING START/STOP SCL 6 7 SDA Start DS21166J-page Stop © 2005 Microchip Technology Inc. ...
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... SCL SDA Start Condition © 2005 Microchip Technology Inc. 24AA52/24LCS52 3.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal ...
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... Device Addressing A control byte is the first byte received following the Start condition from the master device. The first part of the control byte consists of a 4-bit control code which is set to ‘1010’ for normal read and write operations and ‘0110’ for writing to the write-protect register. The control byte is followed by three Chip Select bits (A2, A1, A0) ...
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... A Master Byte R T SDA Line S Bus Activity FIGURE 4-2: PAGE WRITE S T Bus Activity Control A Master Byte R T SDA Line S Bus Activity © 2005 Microchip Technology Inc. 24AA52/24LCS52 Word Address Word Address (n) Data ( Data ...
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... ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle ...
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... Figure 6-2. In order for the command to work, a voltage of Vcc + 5.5V must be applied to the WP pin and must be sustained for 1 S before the command is given. The customer should also allow for delay after the Stop bit for © 2005 Microchip Technology Inc. 24AA52/24LCS52 Word Address ...
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... FIGURE 6-2: RESETTING WRITE-PROTECT FUSE (RWPF 5. Bus Activity Command Master SDA Line Bus Activity Note: Clock = 100 kHz 6.3 Hardware Write-Protect The WP pin can be tied tied entire array will be write-protected, regardless of whether the software write-protect register has been written or not ...
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... R T SDA Line S Bus Activity © 2005 Microchip Technology Inc. 24AA52/24LCS52 7.3 Sequential Read Sequential reads are initiated in the same way as a random read, with the exception that after the 24XXX52 transmits the first data byte, the master issues an acknowledge, as opposed to a Stop condition in a random read ...
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... FIGURE 7-2: RANDOM READ S Bus Activity T Control A Master Byte SDA Line Bus Activity FIGURE 7-3: SEQUENTIAL READ Bus Activity Control Master Byte Data (n) SDA Line A Bus Activity C K DS21166J-page 12 S Word T Control A Address (n) Byte Data ( ...
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... CC 400 kHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. © 2005 Microchip Technology Inc. 24AA52/24LCS52 TSSOP MSOP DFN Chip Address Input ...
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... TSSOP XXXX TYWW NNN 8-Lead MSOP XXXXXT YWWNNN 8-Lead 2x3 DFN XXX YWW NN Part Number 24AA52 24LCS52 DS21166J-page 14 Example: 24AA52 I/P Example: 24LCS52I SN Example: Example: Example: 1st Line Marking Codes TSSOP MSOP A52 4A52I S52 4S52I e 3EC 3 0510 e 3 0510 3EC ...
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... Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. © 2005 Microchip Technology Inc. 24AA52/24LCS52 DS21166J-page 15 ...
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... Plastic Dual In-line (P) – 300 mil (PDIP Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width ...
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... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 © 2005 Microchip Technology Inc. 24AA52/24LCS52 Units ...
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... Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...
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... Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187 Drawing No. C04-111 © 2005 Microchip Technology Inc. 24AA52/24LCS52 Units INCHES ...
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... Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated D PIN 1 ID INDEX AREA (NOTE 1) TOP VIEW A3 Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Overall Width Exposed Pad Length Exposed Pad Width Contact Length § ...
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... Standard and Pb-free finishes. Corrections to Section 1.0, Electrical Characteristics; Product ID System, added lead finish info. Revision H Added Reset Software Write-Protect feature. Added 2x3 DFN package option. Revision J Revised Sections 6.3 and 8.4. Revised DFN Package Drawing. © 2005 Microchip Technology Inc. 24AA52/24LCS52 DS21166J-page 21 ...
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... NOTES: DS21166J-page 22 © 2005 Microchip Technology Inc. ...
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... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2005 Microchip Technology Inc. 24AA52/24LCS52 CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...
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... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA52/24LCS52 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...
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... To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Package Range Device: 24AA52: = 1.8V, 2 Kbit I 24AA52T: = 1.8V, 2 Kbit I (Tape and Reel) 24LCS52: = 2.2V, 2 Kbit I 24LCS52T: = 2.2V, 2 Kbit I (Tape and Reel) Temperature I = -40°C to +85°C Range: Package Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (150 mil body), 8-lead ST = Plastic TSSOP (4 ...
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... NOTES: DS21166J-page 26 2005 Microchip Technology Inc. ...
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... Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. ...
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