AT93C46-W1.8-11 ATMEL [ATMEL Corporation], AT93C46-W1.8-11 Datasheet - Page 11

• Manufacturer Part Number: AT93C46-W1.8-11
• Description: Three-wire Serial EEPROMs
• Manufacturer: ATMEL [ATMEL Corporation]

AT93C46 Ordering Information
Notes:
0172Z–SEEPR–9/05
Ordering Code
AT93C46-10PI-2.7
AT93C46-10SI-2.7
AT93C46R-10SI-2.7
AT93C46W-10SI-2.7
AT93C46-10TI-2.7
AT93C46-10PI-1.8
AT93C46-10SI-1.8
AT93C46R-10SI-1.8
AT93C46W-10SI-1.8
AT93C46-10TI-1.8
AT93C46-10PU-2.7
AT93C46-10PU-1.8
AT93C46-10SU-2.7
AT93C46-10SU-1.8
AT93C46W-10SU-2.7
AT93C46W-10SU-1.8
AT93C46-10TU-2.7
AT93C46-10TU-1.8
AT93C46Y1-10YU-2.7
AT93C46Y1-10YU-1.8
AT93C46Y5-10YU-2.7
AT93C46Y5-10YU-1.8
AT93C46U3-10UU-2.7
AT93C46U3-10UU-1.8
AT93C46-W2.7-11
AT93C46-W1.8-11
8P3
8S1
8S2
8A2
8U3-1
8Y1
8Y5
−2.7
−1.8
R
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the Table 3 on page 3 and Table 4 on
2. Available in waffle pack and wafer form, order as SL719 for wafer form. Bumped die available upon request.
page 4.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-ball, Die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
Rotated Pinout
(2)
(2)
(1)
Package Type
Options
Package
Die Sale
Die Sale
8U3-1
8U3-1
8P3
8S1
8S1
8S2
8A2
8P3
8S1
8S1
8S2
8A2
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8Y1
8Y1
8Y5
8Y5
Lead-free/Halogen-free/
Industrial Temperature
AT93C46/56/66
Operation Range
(−40°C to 85°C)
(−40°C to 85°C)
(−40°C to 85°C)
(−40°C to 85°C)
Industrial
Industrial
Industrial
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