LM2901DGKR ROHM [Rohm], LM2901DGKR Datasheet - Page 15

• Manufacturer Part Number: LM2901DGKR
• Description: TROPHY SERIES Comparators
• Manufacturer: ROHM [Rohm]

●Derating Curves
●Precautions
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LM393DR/PWR/DGKR,LM2903DR/PWR/DGKR/VQDR/VQPWR
LM339DR/PWR,LM2901DR/PWR/VQDR/VQPWR
10) Board inspection
1) Unused circuits
2) Input terminal voltage
3) Power supply (single / dual)
4) Power dissipation Pd
5) Short-circuit between pins and erroneous mounting
6) Terminal short-circuits
7) Operation in a strong electromagnetic field
8) Radiation
9) IC handing
When there are unused circuits it is recommended that they be connected as in Fig.92,
setting the non-inverting input terminalto a potential within the in-phase input voltage range (VICR).
Applying GND + 36V to the input terminal is possible without causing deterioration of the electrical
normal circuit operation.
Please note that the circuit operates normally only when the input voltage is within the common
mode input voltage range of the electric characteristics.
The op-amp operates when the specified voltage supplied is between Vcc and GND. Therefore, the single supply op-amp can be used as
a dual supply op-amp as well.
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip
temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual
operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information.
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power
supply, or the output and GND may result in IC destruction.
When the output and Vcc terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently,
destruction.
Operation in a strong electromagnetic field may cause malfunctions.
This IC is not designed to withstand radiation.
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to
piezoelectric (piezo) effects.
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is
recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before
inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and
storage.
characteristics or destruction, irrespective of the supply voltage. However, this does not ensure
SOIC8 (*8)
TSSOP8 (*6)
MSOP8/VSSOP8 (*7)
Power Dissipation
Package
LM2903DR/PWR/DGKR/VQDR/VQPWR
800
600
400
200
0
0
LM393DR
LM2903DR/VQDR
LM393PWR
LM2903PWR/VQPWR
LM393DR/PWR/DGKR
25
AMBIENT TEMPERATURE [℃]
LM393PWR
LM2903PWR/VQPWR
Pd[W]
50
450
500
470
75
100
θja = (Tj-Ta)/Pd[℃/W]
125
θja [℃/W]
Fig.91 Derating Curves
3.76
3.6
4.0
150
15/17
Power Dissipation
1000
800
600
400
200
LM2901DR/PWR/VQDR/VQPWR
TSSOP14
Package
0
SOIC14
0
AMBIENT TEMPERATURE [℃]
25
LM339DR/PWR
50
LM339PWR
LM2901PWR/VQPWR
75
LM339DR
LM2901DR/VQDR
Fig.92 Disable circuit example
100
Pd[W]
125
610
870
150
Technical Note
2011.06 - Rev.B
θja = (Tj-Ta)/Pd[℃/W]
－
＋
GND
V cc
θja [℃/W]
4.9
7.0