BU6650NUX_11 ROHM [Rohm], BU6650NUX_11 Datasheet - Page 19

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BU6650NUX_11

Manufacturer Part Number
BU6650NUX_11
Description
3ch CMOS LDO Regulators
Manufacturer
ROHM [Rohm]
Datasheet
●About power dissipation (Pd)
© 2011 ROHM Co., Ltd. All rights reserved.
BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX
www.rohm.com
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (P
P
Fig.124 VSON008X2030 Power dissipation heat reduction characteristics (Reference)
MAX
0.7
0.6
0.5
0.4
0.3
0.2
0.1
(V
0
IN
=(V
0
: Input voltage V
0.66W
IN
-V
OUT1
25
)×I
OUT1
OUT1,2,3
(MAX.)+(V
50
Ta [ ℃ ]
: Output voltage I
IN
75
-V
OUT2
85
)×I
100
OUT2
OUT
19/21
(MAX.)+(V
(MAX) : Maximum output current)
125
MAX
)
IN
-V
OUT3
* Please design the margin so that P
- Standard ROHM board -
Size: 70 mm  70 mm  1.6 mm
Material : Glass epoxy board
becomes is than Pd (P
the usage temperature range.
)×I
OUT3
(MAX.)
MAX
Pd) within
Technical Note
2011.03 - Rev.E
MAX

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