EL5111_07 INTERSIL [Intersil Corporation], EL5111_07 Datasheet - Page 17
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EL5111_07
Manufacturer Part Number
EL5111_07
Description
60MHz Rail-to-Rail Input-Output Op Amps
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.EL5111_07.pdf
(18 pages)
HMSOP (Heat-Sink MSOP) Package Family
EXPOSED
THERMAL PAD
SEATING
PLANE
(N/2)
B
0.25
C
N LEADS
1
GAUGE
PLANE
0.10 C
c
L1
3° ±3°
END VIEW
e
BOTTOM VIEW
PIN #1
I.D.
TOP VIEW
SIDE VIEW
E1
17
DETAIL X
E
b
E2
L
SEE DETAIL "X"
H
0.08
N
D
M
EL5111, EL5211, EL5411
D1
(N/2)+1
A
C A B
A1
A
0.25
A2
M
C A B
MDP0050
HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
2. Plastic interlead protrusions of 0.25mm maximum per side are
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
SYMBOL
included.
not included.
A1
A2
D1
E1
E2
L1
A
D
E
N
b
c
e
L
HMSOP8 HMSOP10
0.075
1.00
0.86
0.30
0.15
3.00
1.85
4.90
3.00
1.73
0.65
0.55
0.95
8
0.075
1.00
0.86
0.20
0.15
3.00
1.85
4.90
3.00
1.73
0.50
0.55
0.95
10
TOLERANCE
+0.025/-0.050
+0.07/-0.08
Reference
Reference
Reference
±0.09
±0.05
±0.10
±0.15
±0.10
Basic
±0.15
Basic
Max.
Rev. 0 10/03
January 10, 2007
NOTES
1, 3
2, 3
-
-
-
-
-
-
-
-
-
-
-
-
FN7119.5