MCP6273 MICROCHIP [Microchip Technology], MCP6273 Datasheet - Page 28

• Manufacturer Part Number: MCP6273
• Description: 170 ?A, 2 MHz Rail-to-Rail Op Amp
• Manufacturer: MICROCHIP [Microchip Technology]

MCP6271/1R/2/3/4/5
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
DS21810E-page 28
Note:
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold fla sh or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tole rance, for information purposes only.
JEDEC Equivalent: MO-153 AB-1
Drawing No. C04-087
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
See ASME Y14.5M
See ASME Y14.5M
p
β
n
Dimension Limits
E1
E
Units
A2
E1
A1
D
φ
B
n
p
A
E
L
c
α
β
MIN
.004
.039
.033
.002
.246
.169
.193
.020
.007
2
1
0°
.026 BSC
12° REF
12° REF
INCHES
L
φ
NOM
D
.035
.004
.173
.197
.024
.006
.010
.041
.251
14
4°
A1
MAX
A
.043
.037
.006
.256
.177
.028
.008
.012
.201
8°
MIN
1.00
0.85
0.05
6.25
4.30
4.90
0.50
0.09
0.19
0°
MILLIMETERS*
© 2006 Microchip Technology Inc.
Revised: 08-17-05
0.65 BSC
12° REF
12° REF
NOM
1.05
0.90
0.10
6.38
4.40
5.00
0.60
0.15
0.25
14
4°
A2
MAX
1.10
0.95
0.15
6.50
4.50
5.10
0.70
0.20
0.30
8°
α