LT5527 LINER [Linear Technology], LT5527 Datasheet - Page 15

• Manufacturer Part Number: LT5527
• Description: 400MHz to 3.7GHz 5V High Signal Level Downconverting Mixer
• Manufacturer: LINER [Linear Technology]

PACKAGE DESCRIPTION
4.35 ± 0.05
2.90 ± 0.05
2.15 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4.00 ± 0.10
(4 SIDES)
16-Lead Plastic QFN (4mm × 4mm)
0.65 BSC
0.30 ±0.05
(Reference LTC DWG # 05-08-1692)
0.72 ±0.05
PACKAGE OUTLINE
0.75 ± 0.05
UF Package
0.200 REF
0.00 – 0.05
2.15 ± 0.10
(4-SIDES)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
15
16
0.65 BSC
0.30 ± 0.05
0.55 ± 0.20
1
2
(UF16) QFN 10-04
PIN 1 NOTCH R = 0.20 TYP
OR 0.35 × 45° CHAMFER
LT5527
15
5527fa