ADA4853-1_07 AD [Analog Devices], ADA4853-1_07 Datasheet - Page 5

• Manufacturer Part Number: ADA4853-1_07
• Description: Low Power, Rail-to-Rail Output, Video Op Amps with Ultralow Power
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for the device soldered in the circuit board for
surface-mount packages.
Table 4.
Package Type
6-Lead SC70
16-Lead LFCSP_VQ
14-Lead TSSOP
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4853-1/
ADA4853-2/ADA4853-3 is limited by the associated rise in
junction temperature (T
which is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
can change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
amplifiers. Exceeding a junction temperature of 150°C for an
extended period can result in changes in silicon devices,
potentially causing degradation or loss of functionality.
JA
6-Lead SC70
16-Lead LFCSP_VQ
14-Lead TSSOP
is specified for the worst-case conditions, that is, θ
J
) on the die. At approximately 150°C,
θ
430
63
120
JA
5.5 V
Rating
See Figure 6
−V
±V
−65°C to +125°C
−40°C to +85°C
−40°C to +105°C
−40°C to +105°C
JEDEC J-STD-20
150°C
S
S
− 0.2 V to +V
Unit
°C/W
°C/W
°C/W
JA
S
is
− 1.2 V
Rev. C | Page 5 of 16
The power dissipated in the package (P
resistor load is the total power consumed from the supply
minus the load power.
RMS output voltages should be considered.
Airflow increases heat dissipation, effectively reducing θ
In addition, more metal directly in contact with the package
leads and through holes under the device reduces θ
Figure 6 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SC70
(430°C/W), the 14-lead TSSOP (120°C/W), and the 16-lead
LFCSP_VQ (63°C/W) on a JEDEC standard 4-layer board. θ
values are approximations.
ESD CAUTION
Figure 6. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
P
P
D
D
3.0
2.5
2.0
1.5
1.0
0.5
= Total Power Consumed − Load Power
ADA4853-1/ADA4853-2/ADA4853-3
=
0
–55
(
V
SUPPLY
–35
TSSOP
SC70
VOLTAGE
–15
AMBIENT TEMPERATURE (°C)
×
5
I
SUPPLY
LFCSP
25
CURRENT
45
D
) for a sine wave and a
65
)
–
V
85
OUT
R
L
2
105
JA
.
125
JA
.
JA