ADA4851-4YRUZ-R7 AD [Analog Devices], ADA4851-4YRUZ-R7 Datasheet - Page 6

• Manufacturer Part Number: ADA4851-4YRUZ-R7
• Description: Low Cost, High Speed, Rail-to-Rail Output Op Amps
• Manufacturer: AD [Analog Devices]

ADA4851-1/ADA4851-2/ADA4851-4
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature
Operating Temperature Range
Lead Temperature Range
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for device soldered in circuit board for surface-mount
packages.
Table 5. Thermal Resistance
Package Type
6-lead SOT-23
14-lead TSSOP
8-lead MSOP
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4851-1/
ADA4851-2/ADA4851-4 is limited by the associated rise in
junction temperature (T
which is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
amplifiers. Exceeding a junction temperature of 150°C for an
extended period of time can result in changes in silicon devices,
potentially causing degradation or loss of functionality.
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the die
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
JA
is specified for the worst-case conditions, that is, θ
J
) on the die. At approximately 150°C,
Rating
12.6 V
See Figure 5
−V
+V
−65°C to +125°C
−40°C to +125°C
JEDEC J-STD-20
150°C
θ
170
120
150
JA
S
S
D
) is the sum of the
− 0.5 V to +V
to −V
S
Unit
°C/W
°C/W
°C/W
S
JA
+ 0.5 V
is
Rev. C | Page 6 of 20
due to the amplifiers’ drive at the output. The quiescent power
is the voltage between the supply pins (V
current (I
RMS output voltages should be considered. If R
to −V
V
worst case, when V
In single-supply operation with R
is V
Airflow increases heat dissipation, effectively reducing θ
Also, more metal directly in contact with the package leads and
through holes under the device reduces θ
Figure 5 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SOT-23
(170°C/W), the 8-lead MSOP (150°C/W), and the 14-lead
TSSOP (120°C/W) on a JEDEC standard 4-layer board. θ
values are approximations.
Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
S
× I
OUT
P
2.0
1.5
1.0
0.5
P
P
S
OUT
D
0
D
, as in single-supply operation, the total drive power is
D
–55
= V
= Quiescent Power + (Total Drive Power − Load Power)
=
=
. If the rms signal levels are indeterminate, consider the
–45 –35 –25 –15 –5
S
).
(
(
V
V
S
/2.
S
S
×
×
SOT-23-6
I
I
S
S
)
)
+
+
OUT
AMBIENT TEMPERATURE (°C)
⎛
⎜
⎝
(
TSSOP
V
V
= V
2
S
R
S
5
4 /
L
×
15 25 35 45 55 65 75 85 95 105 115
S
)
MSOP
V
/4 for R
2
R
OUT
L
⎞
⎟
⎠
L
–
L
referenced to −V
V
to midsupply.
OUT
R
L
2
S
JA
) times the quiescent
.
L
is referenced
S
, worst case
125
JA
JA
.