LM6121H/883 NSC [National Semiconductor], LM6121H/883 Datasheet

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LM6121H/883

Manufacturer Part Number
LM6121H/883
Description
High Speed Buffer
Manufacturer
NSC [National Semiconductor]
Datasheet
© 1999 National Semiconductor Corporation
LM6121/LM6221/LM6321
High Speed Buffer
General Description
These high speed unity gain buffers slew at 800 V/µs and
have a small signal bandwidth of 50 MHz while driving a 50
load. They can drive
while driving large capacitive loads. The LM6121 family are
monolithic ICs which offer performance similar to the
LH0002 with the additional features of current limit and ther-
mal shutdown.
These buffers are built with National’s VIP
grated PNP) process which provides fast PNP transistors
that are true complements to the already fast NPN devices.
This advanced junction-isolated process delivers high speed
performance without the need for complex and expensive di-
electric isolation.
Simplified Schematic
Numbers in ( ) are for 8-pin N DIP.
VIP
is a trademark of National Semiconductor Corporation.
±
300 mA peak and do not oscillate
DS009223
(Vertically Inte-
Features
n High slew rate:
n Wide bandwidth: 50 MHz
n Slew rate and bandwidth 100% tested
n Peak output current:
n High input impedance: 5 M
n LH0002H pin compatible
n No oscillations with capacitive loads
n 5V to
n Current and thermal limiting
n Fully specified to drive 50
Applications
n Line Driving
n Radar
n Sonar
±
15V operation guaranteed
DS009223-1
800 V/µs
±
300 mA
lines
www.national.com
May 1998

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LM6121H/883 Summary of contents

Page 1

LM6121/LM6221/LM6321 High Speed Buffer General Description These high speed unity gain buffers slew at 800 V/µs and have a small signal bandwidth of 50 MHz while driving a 50 ± load. They can drive 300 mA peak and do not ...

Page 2

... These pins are at V potential. www.national.com Plastic DIP DS009223-2 Order Number LM6221N, LM6321N or LM6121J/883 See NS Package Number J08A or N08E Metal Can DS009223-3 Top View Order Number LM6221H or LM6121H/883 See NS Package Number H08C Plastic SO DS009223-7 Order Number LM6321M See NS Package Number M14A 2 ...

Page 3

... PSSR Power Supply V Rejection Ratio (Note 1) Junction Temperature (T Operating Ratings Operating Temperature Range ± 36V ( 18) LM6121H/883 ± 7V LM6221 ± Vsupply LM6321 Continuous Operating Supply Range Thermal Resistance ( −65˚C to +150˚C H Package N Package 260˚C M Package (Note 10) Thermal Resistance ( ± ...

Page 4

AC Electrical Characteristics The following specifications apply for Supply Voltage = = Boldface limits apply for MIN Symbol Parameter = SR Slew Rate Slew Rate ...

Page 5

Typical Performance Characteristics Overshoot vs Capacitive Load DS009223-14 Supply Current DS009223-17 Slew Rate DS009223-20 Forward Transmission Gain (S12) DS009223-23 = 25˚C, unless otherwise specified (Continued Large Signal Response = DS009223-15 −3 dB Bandwidth DS009223-18 ...

Page 6

Application Hints POWER SUPPLY DECOUPLING The method of supply bypassing is not critical for stability of the LM6121 series buffers. However, their high current out- put combined with high slew rate can result in significant voltage transients on the power ...

Page 7

Application Hints (Continued) The heatsink for the LM6321 is made using the PC board copper. The heat is conducted from the die, through the lead frame (inside the part), and out the pins which are soldered to the PC board. ...

Page 8

... Physical Dimensions inches (millimeters) unless otherwise noted www.national.com Metal Can Package (H) Order Number LM6221H or LM6121H/883 NS Package Number H08C 8-Pin Ceramic Dual-In-Line Package (J) Order Number LM6121J/883 NS Package Number J08A 8 ...

Page 9

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Pin Small Outline Package (M) Order Number LM6321M NS Package Number M14A Molded Dual-In-Line Package (N) Order Number LM6221N or LM6321N NS Package Number N08E 9 www.national.com ...

Page 10

LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems ...

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