ISD2575 WINBOND [Winbond], ISD2575 Datasheet - Page 30

• Manufacturer Part Number: ISD2575
• Description: ISD2560
• Manufacturer: WINBOND [Winbond]

11. TYPICAL APPLICATION CIRCUIT
Note: If desired, pin 18 (PDIP package) may be left unconnected (microphone preamplifier noise will be higher). In
this case, pin 18 must not be tied to any other signal or voltage. Additional design example schematics are
provided below.
V
CC
CHIP ENABLE
POWER DOWN
PLAYBACK/RECORD
100 K
R4
Ω
V
SS
FIGURE 5: DESIGN SCHEMATIC
23
24
26
10
27
25
22
8
1
2
3
4
5
6
7
9
OVF
A7
P/R
OEM
A0
A1
A2
A3
A4
A5
A6
A8
A9
CE
PD
XCLK
ISD2560/75/90/120
470 K
ANA OUT
- 30 -
R2
MIC REF
Ω
ANA IN
AUX IN
AGC
V
V
V
V
SP+
MIC
SP-
CCD
CCA
SSD
SSA
28
16
12
13
14
15
11
20
21
18
17
19
0.1
C2
4.7
µ
C6
R6
µ
(Note)
F
5.1 K
F
1 K
Ω
R1
Ω
V
CC
ISD2560/75/90/120
220
C7
C3
C4
0.1
0.1
V
CC
µ
µ
µ
10 K
R3
F
F
F
0.1
Ω
MICROPHONE
µ
C1
ELECTRET
F
SPEAKER
C8
22
16
µ
Ω
F
10 K
R5
C5
0.1
Ω
µ
F