ADV3203 AD [Analog Devices], ADV3203 Datasheet - Page 6

• Manufacturer Part Number: ADV3203
• Manufacturer: AD [Analog Devices]

ADV3202/ADV3203
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Analog Supply Voltage (V
Digital Supply Voltage
Ground Potential Difference
Maximum Potential Difference
V
Analog Input Voltage
Digital Input Voltage
Output Voltage
Output Short-Circuit Duration
Output Short-Circuit Current
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
176-Lead LQFP_EP
JA
REF
(DVCC − D
(V
DVCC − V
Disabled Outputs
|V
ADV3202
ADV3203
(Disabled Analog Output)
(Soldering, 10 sec)
is specified for the worst-case conditions, that is, a device
Input Voltage
CLAMP
NEG
ADV3202 (|V
ADV3203 (|V
− D
− V
GND
NEG
INxx
GND
)
|
)
OSD
OSD
− V
−(V
OUT
OUT
POS
|)
+V
− V
REF
NEG
)/2|)
)
Rating
7.5 V
6 V
+0.5 V to –4 V
9.4 V
<3 V
<3 V
6 V
V
V
V
DVCC
(V
Momentary
45 mA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
POS
POS
NEG
θ
16
POS
JA
– 3.5 V to V
– 4 V to V
to V
− 1 V) to (V
POS
Unit
°C/W
NEG
NEG
NEG
+ 4 V
+ 3.5 V
+ 1 V)
Rev. 0 | Page 6 of 20
POWER DISSIPATION
The ADV3202/ADV3203 are operated with ±2.5 V, +5 V, or
±3.3 V supplies and can drive loads down to 150 Ω, resulting in
a large range of possible power dissipations. For this reason,
extra care must be taken while derating the operating conditions
based on ambient temperature.
Packaged in a 176-lead exposed-pad LQFP, the ADV3202/
ADV3203 junction-to-ambient thermal impedance (θ
16°C/W. For long-term reliability, the maximum allowed
junction temperature of the die should not exceed 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in stresses exerted on the die by
the package. Exceeding a junction temperature of 175°C for an
extended period can result in device failure. Figure 3 shows the
range of allowed internal die power dissipations that meet these
conditions over the −40°C to +85°C ambient temperature range.
When using Figure 3, do not include external load power in the
maximum power calculation, but do include load current
dropped on the die output transistors.
ESD CAUTION
Figure 3. Maximum Die Power Dissipation vs. Ambient Temperature
9
8
7
6
5
4
3
15
25
AMBIENT TEMPERATURE (°C)
35
45
55
65
T
J
= 150°C
75
JA
) is
85