ADG1236 AD [Analog Devices], ADG1236 Datasheet - Page 14

• Manufacturer Part Number: ADG1236
• Manufacturer: AD [Analog Devices]

ADG1236
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1236YRU
ADG1236YCP
Temperature Range
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
0.15
0.05
12 MAX
4.50
4.40
4.30
PIN 1
Figure 32. 12-Lead Lead Frame Chip Scale Package [VQ_LFCSP]
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
BSC SQ
16
VIEW
0.30
0.23
0.18
TOP
1
3.00
COPLANARITY
0.80 MAX
0.65 TYP
Dimensions shown in inches and (millimeters
COMPLIANT TO JEDEC STANDARDS MO-153AB
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
5.10
5.00
4.90
0.10
3 mm × 3 mm Body, Very Thin Quad
Package Description
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Dimensions shown in millimeters
0.30
0.19
BSC SQ
0.20 REF
2.75
Rev. PrD | Page 14 of 16
9
8
1.20
MAX
0.05 MAX
0.02 NOM
SEATING
PLANE
BSC
6.40
(BOTTOM VIEW)
EXPOSED PAD
(CP-12-1)
(RU-16)
0.45
0.20
0.09
COPLANARITY
0.60 MAX
BSC
0.50
0.08
8°
0°
9
8
7
10
6
11
5
12
4
1
2
3
0.75
0.55
0.35
Preliminary Technical Data
* 1.45
0.25 MIN
0.75
0.60
0.45
1.30 SQ
1.15
PIN 1
INDICATOR
Package Option
RU-16
CP-12-1