ADG709 AD [Analog Devices], ADG709 Datasheet - Page 5

• Manufacturer Part Number: ADG709
• Description: CMOS, 3 ohm Low Voltage 4-/8-Channel Multiplexers
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog Inputs
Digital Inputs
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG708/ADG709 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Model
ADG708BRU
ADG709BRU
ADG708CRU
ADG709CRU
REV. 0
A2
X
0
0
0
0
1
1
1
1
X = Don’t Care
A1
X
0
0
1
1
X = Don’t Care.
DD
DD
SS
. . . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle max)
A
Industrial (B, C Versions) . . . . . . . . . . . . . –40 C to +85 C
= 25 C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
SS
A1
X
0
0
1
1
0
0
1
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
2
2
. . . . . . . . . . . . . . V
. . . . . . . . . . . . . . . . . . –0.3 V to V
A0
X
0
1
0
1
Table II. ADG709 Truth Table
Table I. ADG708 Truth Table
A0
X
0
1
0
1
0
1
0
1
Temperature Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
EN
0
1
1
1
1
30 mA, Whichever Occurs First
30 mA, Whichever Occurs First
EN
0
1
1
1
1
1
1
1
1
SS
1
– 0.3 V to V
Switch Condition
NONE
1
2
3
4
5
6
7
8
ON Switch Pair
NONE
1
2
3
4
DD
DD
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
Package Description
+0.3 V or
+0.3 V or
ORDERING GUIDE
–5–
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 432 mW
Lead Temperature, Soldering
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
limited to the maximum ratings given.
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 C
JA
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 27.6 C/W
PIN CONFIGURATIONS
S1A
S2A
S3A
S4A
V
V
EN
DA
EN
A0
A0
S1
S2
S3
S4
SS
SS
D
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
(Not to Scale)
(Not to Scale)
TOP VIEW
TOP VIEW
ADG709
ADG708
TSSOP
ADG708/ADG709
WARNING!
16
15
14
13
12
11
10
16
15
14
13
12
11
10
9
9
A1
GND
V
S1B
S2B
S3B
S4B
DB
A1
A2
GND
V
S5
S6
S7
S8
DD
DD
ESD SENSITIVE DEVICE
Package Option
RU-16
RU-16
RU-16
RU-16