HCPL-5200-100 HP [Agilent(Hewlett-Packard)], HCPL-5200-100 Datasheet - Page 3

• Manufacturer Part Number: HCPL-5200-100
• Description: Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers
• Manufacturer: HP [Agilent(Hewlett-Packard)]

20 Terminal LCCC Surface Mount, 2 Channels
Functional Diagrams
Note: Multichannel DIP and flat pack devices have common V
ceramic chip carrier) package has isolated channels with separate V
Outline Drawings
16 Pin Flat Pack, 4 Channels
8.70 (0.342)
9.10 (0.358)
1
2
3
4
1.78 (0.070)
2.03 (0.080)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
Through Hole
8 Pin DIP
1 Channel
GND
V
11.13 (0.438)
10.72 (0.422)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
V
CC
V
2.85 (0.112)
O
E
0.64
(0.025)
(20 PLCS)
MAX.
0.89 (0.035)
0.69 (0.027)
8
7
6
5
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.02 (0.040) (3 PLCS)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
1.14 (0.045)
1.40 (0.055)
1
2
3
4
Through Hole
2 Channels
8 Pin DIP
GND
V
V
V
CC
O1
O2
8.13 (0.320)
7.24 (0.285)
6.99 (0.275)
(0.206)
MAX.
MAX.
5.23
8
7
6
5
CC
0.51 (0.020)
2.29 (0.090)
2.79 (0.110)
and ground. Single channel DIP has an enable pin 6. LCCC (leadless
MIN.
CC
and ground connections.
8 Pin DIP Through Hole, 1 and 2 Channel
16 Pin Flat Pack
Unformed Leads
1
2
3
4
5
6
7
8
0.88 (0.0345)
9.02 (0.355)
8.76 (0.345)
4 Channels
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
MIN.
0.76 (0.030)
1.27 (0.050)
9.40 (0.370)
9.91 (0.390)
GND
V
V
V
V
V
CC
O1
O2
O3
O4
2.29 (0.090)
16
15
14
13
12
11
10
9
3
0.51 (0.020)
MAX.
3.81 (0.150)
MAX.
0.46 (0.018)
0.36 (0.014)
0.31 (0.012)
0.23 (0.009)
1.27 (0.050)
MIN.
4.32 (0.170)
REF.
MAX.
19
20
2
3
20 Pad LCCC
Surface Mount
2 Channels
GND
V
1
CC2
15
8.13 (0.320)
7.16 (0.282)
7.57 (0.298)
7.36 (0.290)
7.87 (0.310)
V
V
7
0.20 (0.008)
0.33 (0.013)
O2
O1
MAX.
GND
8
V
CC1
2
13
12
10