HCPL-314J-300 HP [Agilent(Hewlett-Packard)], HCPL-314J-300 Datasheet - Page 4

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HCPL-314J-300

Manufacturer Part Number
HCPL-314J-300
Description
0.4 Amp Output Current IGBT Gate Drive Optocoupler
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet
TEMPERATURE
ROOM
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
0
p
L
= 200 °C, T
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
t
L
TIME (SECONDS)
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
4
Regulatory Information
The HCPL-J314 has been
approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
UL
Approval under UL 1577,
component recognition program
up to V
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Teil 2):2003-01
ISO
= 3750 V
rms
. File

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