TH8056KDCA MELEXIS [Melexis Microelectronic Systems], TH8056KDCA Datasheet - Page 25

• Manufacturer Part Number: TH8056KDCA
• Description: Enhanced Single Wire CAN Transceiver
• Manufacturer: MELEXIS [Melexis Microelectronic Systems]

9. Assembly Information
Standard information regarding manufacturability of Melexis products with different soldering
processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
Iron Soldering THD’s (Through Hole Devices)
•
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of
the Use of Certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality_leadfree.asp
TH8056 – Datasheet
3901008056
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
Page 25 of 26
Enhanced Single Wire CAN Transceiver
TH8056
March 2007
Rev 012