ISL89160 INTERSIL [Intersil Corporation], ISL89160 Datasheet - Page 11

• Manufacturer Part Number: ISL89160
• Description: High Speed, Dual Channel, 6A, 4.5 to 16VOUT, Power MOSFET Driver
• Manufacturer: INTERSIL [Intersil Corporation]

• Large power components (Power FETs, Electrolytic
• If you simulate your circuits, consider including
General EPAD Heatsinking
Considerations
The thermal pad is electrically connected to the GND
supply through the IC substrate. The epad of the
ISL89163/164/165 has two main functions: to provide a
quiet Gnd for the input threshold comparators and to
provide heat sinking for the IC. The EPAD must be
connected to a ground plane and no switching currents
from the driven FET should pass through the ground
plane under the IC.
Figure 16 is a PCB layout example of how to use vias to
remove heat from the IC through the epad.
For maximum heatsinking, it is recommended that a
ground plane, connected to the EPAD, be added to both
sides of the PCB. A via array, within the area of the EPAD,
will conduct heat from the EPAD to the gnd plane on the
bottom layer. The number of vias and the size of the gnd
planes required for adequate heatsinking is determined
by the power dissipated by the ISL89160, ISL89161,
ISL89162, the air flow and the maximum temperature of
the air around the IC.
FIGURE 16. TYPICAL PCB PATTERN FOR THERMAL
caps, power resistors, etc.) will have internal
parasitic inductance which cannot be eliminated. This
must be accounted for in the PCB layout and circuit
design.
parasitic components especially parasitic inductance.
COMPONENT LAYER
EPAD GND
PLANE
VIAS
11
ISL89160, ISL89161, ISL89162
EPAD GND
BOTTOM
PLANE
LAYER
November 2, 2010
FN7719.0