ICL3221E INTERSIL [Intersil Corporation], ICL3221E Datasheet - Page 3

• Manufacturer Part Number: ICL3221E
• Manufacturer: INTERSIL [Intersil Corporation]

Ordering Information
NOTES:
*Add “-T” suffix for tape and reel.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
ICL3232EIAZ* (Note)
ICL3232EIB*
ICL3232EIBZ* (Note)
ICL3232EIBNZ* (Note)
ICL3232EIV-16*
ICL3232EIV-16Z* (Note)
ICL3232EIV-20*
ICL3232EIV-20Z* (Note)
ICL3241ECA*
ICL3241ECAZ* (Note)
ICL3241ECB*
ICL3241ECBZ* (Note)
ICL3241ECV*
ICL3241ECVZ* (Note)
ICL3241EIA*
ICL3241EIAZ* (Note)
ICL3241EIB*
ICL3241EIBZ* (Note)
ICL3241EIV*
ICL3241EIVZ* (Note)
ICL3243ECA*
ICL3243ECAZ* (Note)
ICL3243ECB*
ICL3243ECBZ* (Note)
ICL3243ECV*
ICL3243ECVZA* (Note)
ICL3243ECVZ* (Note)
ICL3243EIA*
ICL3243EIAZ* (Note)
ICL3243EIV*
ICL3243EIVZ* (Note)
PART NUMBER
ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E
3
3232 EIAZ
ICL3232EIB
3232EIBZ
3232EIBNZ
3232E IV-16
3232E IV-16Z
ICL3232 EIV-20
ICL3232 EIV-20Z
ICL 3241ECA
ICL3241 ECAZ
ICL3241ECB
ICL3241ECBZ
ICL3241 ECV
ICL3241 ECVZ
ICL 3241EIA
ICL3241 EIAZ
ICL3241EIB
ICL3241EIBZ
ICL3241 EIV
ICL3241 EIVZ
ICL 3243ECA
ICL32 43ECAZ
ICL3243ECB
ICL3243ECBZ
ICL3243 ECV
ICL3243 ECVZ
ICL3243 ECVZ
ICL 3243EIA
ICL32 43EIAZ
ICL3243 EIV
ICL3243 EIVZ
(Continued)
PART MARKING
TEMPERATURE RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
16 Ld SSOP (Pb-free)
16 Ld SOIC
16 Ld SOIC (Pb-free)
16 Ld SOIC (Pb-free)
16 Ld TSSOP
16 Ld TSSOP (Pb-free)
20 Ld TSSOP
20 Ld TSSOP (Pb-free)
28 Ld SSOP
28 Ld SSOP (Pb-free)
28 Ld SOIC
28 Ld SOIC (Pb-free)
28 Ld TSSOP
28 Ld TSSOP (Pb-free)
28 Ld SSOP
28 Ld SSOP (Pb-free)
28 Ld SOIC
28 Ld SOIC (Pb-free)
28 Ld TSSOP
28 Ld TSSOP (Pb-free)
28 Ld SSOP
28 Ld SSOP (Pb-free)
28 Ld SOIC
28 Ld SOIC (Pb-free)
28 Ld TSSOP
28 Ld TSSOP (Pb-free)
28 Ld TSSOP (Pb-free)
28 Ld SSOP
28 Ld SSOP (Pb-free)
28 Ld TSSOP
28 Ld TSSOP (Pb-free)
PACKAGE
M16.209
M16.3
M16.3
M16.15
M16.173
M16.173
M20.173
M20.173
M28.209
M28.209
M28.3
M28.3
M28.173
M28.173
M28.209
M28.209
M28.3
M28.3
M28.173
M28.173
M28.209
M28.209
M28.3
M28.3
M28.173
M28.173
M28.173
M28.209
M28.209
M28.173
M28.173
PKG. DWG. #
June 22, 2007
FN4910.19