MK60DN256ZVMD10 FREESCALE [Freescale Semiconductor, Inc], MK60DN256ZVMD10 Datasheet - Page 22

• Manufacturer Part Number: MK60DN256ZVMD10
• Description: K60 Sub-Family Data Sheet
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

General
5.4.1 Thermal operating requirements
5.4.2 Thermal attributes
1.
22
Single-layer
(1s)
Four-layer
(2s2p)
Single-layer
(1s)
Four-layer
(2s2p)
—
—
—
Board type
Symbol
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
K60 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Table 11. Thermal operating requirements
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
board
Thermal
resistance,
junction to case
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
Description
45
36
36
30
24
9
2
144 LQFP
48
29
38
25
16
9
2
MAPBGA
144
Min.
–40
–40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor, Inc.
Max.
125
105
1
1
1
1
2
3
4
Notes
Unit
°C
°C