MK60FX512VLQ15 FREESCALE [Freescale Semiconductor, Inc], MK60FX512VLQ15 Datasheet - Page 36
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MK60FX512VLQ15
Manufacturer Part Number
MK60FX512VLQ15
Description
K60 Sub-Family Data Sheet
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
1.MK60FX512VLQ15.pdf
(82 pages)
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Peripheral operating requirements and behaviors
1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant
2. Data retention is based on T
3. Cycling endurance represents number of program/erase cycles at -40°C ≤ T
4. Write endurance represents the number of writes to each FlexRAM location at -40°C ≤Tj ≤ 125°C influenced by the cycling
6.4.1.5 Write endurance to FlexRAM for EEPROM
TBD
6.4.2 EzPort Switching Specifications
36
n
n
n
t
n
n
t
nvmretee100
t
nvmwree128
nvmwree512
nvmretee10
nvmwree32k
Symbol
nvmwree16
nvmretee1
nvmwree4k
25°C profile. Engineering Bulletin EB618 does not apply to this technology.
endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup per subsystem. Minimum and
typical values assume all byte-writes to FlexRAM.
EP1a
Num
EP1
EP2
EP3
EP4
EP5
EP6
EP7
Data retention up to 100% of write endurance
Data retention up to 10% of write endurance
Data retention up to 1% of write endurance
Write endurance
Description
Operating voltage
EZP_CK frequency of operation (all commands except
READ)
EZP_CK frequency of operation (READ command)
EZP_CS negation to next EZP_CS assertion
EZP_CS input valid to EZP_CK high (setup)
EZP_CK high to EZP_CS input invalid (hold)
EZP_D input valid to EZP_CK high (setup)
EZP_CK high to EZP_D input invalid (hold)
EZP_CK low to EZP_Q output valid
Description
• EEPROM backup to FlexRAM ratio = 16
• EEPROM backup to FlexRAM ratio = 128
• EEPROM backup to FlexRAM ratio = 512
• EEPROM backup to FlexRAM ratio = 4096
• EEPROM backup to FlexRAM ratio =
32,768
Table 22. NVM reliability specifications (continued)
K60 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
javg
Table 23. EzPort switching specifications
= 55°C (temperature profile over the lifetime of the application).
Table continues on the next page...
FlexRAM as EEPROM
Preliminary
TBD
TBD
TBD
TBD
TBD
Min.
10
15
5
Typ.
j
TBD
TBD
TBD
TBD
TBD
100
100
≤ 125°C.
50
2 x t
1
1.71
Min.
—
—
EZP_CK
—
5
5
2
5
Max.
—
—
—
—
—
—
—
—
Freescale Semiconductor, Inc.
f
f
Max.
SYS
SYS
3.6
16
—
—
—
—
—
/2
/8
writes
writes
writes
writes
writes
years
years
years
Unit
MHz
MHz
Unit
Notes
ns
ns
ns
ns
ns
ns
V
2
2
2
4