EP2C8 ALTERA [Altera Corporation], EP2C8 Datasheet - Page 2

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EP2C8

Manufacturer Part Number
EP2C8
Description
Cyclone Series Device Thermal Resistance
Manufacturer
ALTERA [Altera Corporation]
Datasheet

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Cyclone III
Devices
2
θ
θ
θ
θ
θ
θ
EP3C5
EP3C10
Table 1. Thermal Resistance Values for Cyclone III Devices
Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2)
JA
JA
JA
JA
JC
JB
Device
(C/W) Still Air
(C/W) 100 ft./minute
(C/W) 200 ft./minute
(C/W) 400 ft./minute
(C/W)
(C/W)
Value
Package
M164
M164
E144
U256
E144
U256
F256
F256
Thermal resistance values for Cyclone III devices are provided for a board
meeting JEDEC specifications and for a typical board. The JEDEC board
specifications require two signals and two power/ground planes and are
available at www.jedec.org. The values are described in
through 4.
Table 2
θ
a board meeting JEDEC specifications for thermal resistance calculation.
JC
(junction-to-case thermal resistance) values for Cyclone III devices on
θ
Junction-to-ambient thermal resistance (θ
is not being used.
Junction-to-ambient thermal resistance with 100 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 200 ft./minute airflow when a
heat sink is not being used.
Junction-to-ambient thermal resistance with 400 ft./minute airflow when a
heat sink is not being used.
Junction-to-case thermal resistance (θ
Junction-to-board thermal resistance (θ
JA
Still Air
32.4
32.5
38.2
32.4
32.5
38.2
provides θ
(
20
20
°
C/W)
DS-CYTHRML-3.0
JA
100 ft./min.
θ
JA
(junction-to-ambient thermal resistance) values and
17.5
28.9
29.1
31.5
17.5
28.9
29.1
31.5
(
°
C/W)
Altera Device Package Information Data Sheet
200 ft./min.
θ
Description
JA
15.4
27.2
29.6
15.4
27.2
29.6
(
27
27
°
C/W)
JC
JB
) for device.
JA
) for specific board being used.
) with no airflow when a heat sink
400 ft./min.
θ
JA
25.5
25.6
27.9
25.5
25.6
27.9
(
14
14
°
C/W)
Altera Corporation
Tables 1
θ
JC
11.7
12.2
11.6
11.7
12.2
11.6
8.4
8.4
(
°
C/W)

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