X9317_09 INTERSIL [Intersil Corporation], X9317_09 Datasheet - Page 4

• Manufacturer Part Number: X9317_09
• Manufacturer: INTERSIL [Intersil Corporation]

Ordering Information
X9317WS8IZ-2.7* (Note 1)
X9317WV8-2.7* (Note 2)
X9317WV8Z-2.7* (Note 1)
X9317WV8I-2.7*, ** (Note 2)
X9317WV8IZ-2.7* (Note)
X9317UM8-2.7* (Note 2)
X9317UM8Z-2.7* (Note 1)
X9317UM8I-2.7*, ** (Note 2)
X9317UM8IZ-2.7* (Note 1)
X9317US8-2.7* (Note 2)
X9317UP-2.7 (Note 2)
X9317UPI-2.7 (Note 2)
X9317US8Z-2.7* (Note 1)
X9317US8I-2.7*, ** (Note 2)
X9317US8IZ-2.7* (Note 1)
X9317UV8-2.7* (Note 2)
X9317UV8Z-2.7* (Note 1)
X9317UV8I-2.7*, ** (Note 2)
X9317UV8IZ-2.7* (Note 1)
X9317TM8-2.7*, ** (Note 2)
X9317TM8Z-2.7* (Note 1)
X9317TM8I-2.7*, ** (Note 2)
X9317TM8IZ-2.7* (Note 1)
X9317TP-2.7 (Note 2)
X9317TPI-2.7 (Note 2)
X9317TS8-2.7*, ** (Note 2)
X9317TS8Z-2.7* (Note 1)
X9317TS8I-2.7*, ** (Note 2)
X9317TS8IZ-2.7* (Note 1)
X9317TV8-2.7*, ** (Note 2)
X9317TV8Z-2.7* (Note 1)
X9317TV8I-2.7*, ** (Note 2)
X9317TV8IZ-2.7* (Note 1)
*Add "T1" suffix for tape and reel. Please refer to
**Add "T2" suffix for tape and reel. Please refer to
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
2. Not recommended for new designs.
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
PART NUMBER
X9317W ZG
317W F
9317W FZ
317W G
AKZ
AED
AOB
AFF
AOH
X9317U F
X9317UP F
X9317UP G
X9317U ZF
X9317U G
X9317U ZG
317U F
9317U FZ
317U G
9317U GZ
AGE
DCP
AGG
DCM
X9317TP F
X9317TP G
X9317T F
X9317T ZF
X9317T G
X9317T ZG
317T F
9317T FZ
317T G
9317T GZ
4
PART MARKING
(Continued)
TB347
TB347
V
CC
2.7 to 5.5
for details on reel specifications.
for details on reel specifications.
(V)
LIMITS
X9317
R
TOTAL
(kΩ)
100
10
50
TEMPERATURE
RANGE (°C)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
8 Ld SOIC (Pb-free)
8 Ld TSSOP
8 Ld TSSOP (Pb-free)
8 Ld TSSOP
8 Ld TSSOP (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld SOIC
8 Ld PDIP
8 Ld PDIP
8 Ld SOIC (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld TSSOP
8 Ld TSSOP (Pb-free)
8 Ld TSSOP
8 Ld TSSOP (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld PDIP
8 Ld PDIP
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld TSSOP
8 Ld TSSOP (Pb-free)
8 Ld TSSOP
8 Ld TSSOP (Pb-free)
PACKAGE
December 16, 2009
M8.15E
M8.173
M8.173
M8.173
M8.173
M8.118
M8.118
M8.118
M8.118
M8.15E
MDP0031
MDP0031
M8.15E
M8.15E
M8.15E
M8.173
M8.173
M8.173
M8.173
M8.118
M8.118
M8.118
M8.118
MDP0031
MDP0031
M8.15E
M8.15E
M8.15E
M8.15E
M8.173
M8.173
M8.173
M8.173
DWG. #
PKG.
FN8183.6