HI3-DAC85V-4 INTERSIL [Intersil Corporation], HI3-DAC85V-4 Datasheet - Page 7
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HI3-DAC85V-4
Manufacturer Part Number
HI3-DAC85V-4
Description
12-Bit, Low Cost, Monolithic D/A Converters
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HI3-DAC85V-4.pdf
(7 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
TIE SUBSTRATE TO:
Metallization Mask Layout
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
108 mils x 163 mils
Type: Al
Thickness: 16k
Ground
Å
2k
Å
BIT 10
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8
BIT 9
BIT 3
BIT 11
BIT 2
BIT 12
HI-DAC80V, HI-DAC85V
HI-DAC80V, HI-DAC85V
(MSB)
BIT 1
10-1040
PASSIVATION:
WORST CASE CURRENT DENSITY:
REF OUT
Type: Nitride over Silox
Nitride Thickness: 3.5k
Silox Thickness: 12k
0.95 x 10
6.3V
5
-V
A/cm
GAIN ADJUST
S
2
Å
V
Å
OUT
1.5k
0.5k
+V
COMMON
SUMMING JUNCTION
20V
SPAN
10V
SPAN
BIPOLAR
OFFSET
REF IN
Å
S
Å