DS3231S- MAXIM [Maxim Integrated Products], DS3231S- Datasheet - Page 18

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DS3231S-

Manufacturer Part Number
DS3231S-
Description
Extremely Accurate I2C-Integrated
Manufacturer
MAXIM [Maxim Integrated Products]
Datasheet
The DS3231 package contains a quartz tuning-fork
crystal. Pick-and-place equipment can be used, but
precautions should be taken to ensure that excessive
shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
Avoid running signal traces under the package, unless
a ground plane is placed between the package and the
Extremely Accurate I
RTC/TCXO/Crystal
18
TOP VIEW
____________________________________________________________________
Handling, PC Board Layout,
INT/SQW
32kHz
N.C.
N.C.
N.C.
N.C.
V
RST
CC
1
2
3
4
5
6
7
8
DS3231
SO
Pin Configuration
and Assembly
16
15
14
13
12
11
10
9
SCL
SDA
V
GND
N.C.
N.C.
N.C.
N.C.
BAT
2
C-Integrated
signal line. All N.C. (no connect) pins must be connect-
ed to ground.
Moisture-sensitive packages are shipped from the fac-
tory dry packed. Handling instructions listed on the
package label must be followed to prevent damage
during reflow. Refer to the IPC/JEDEC J-STD-020 stan-
dard for moisture-sensitive device (MSD) classifications
and reflow profiles. Exposure to reflow is limited to 2
times maximum.
TRANSISTOR COUNT: 33,000
SUBSTRATE CONNECTED TO GROUND
PROCESS: CMOS
Theta-JA: +73°C/W
Theta-JC: +23°C/W
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
16 SO
PACKAGE CODE
Thermal Information
Package Information
W16#H2
Chip Information
DOCUMENT NO.
21-0042

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