AD8324ACP-EVAL AD [Analog Devices], AD8324ACP-EVAL Datasheet - Page 16

• Manufacturer Part Number: AD8324ACP-EVAL
• Description: 3.3 V Upstream Cable Line Driver
• Manufacturer: AD [Analog Devices]

AD8324
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD8324JRQ
AD8324JRQ-REEL
AD8324JRQ-REEL7
AD8324JRQ-EVAL
AD8324ACP
AD8324ACP-REEL7
AD8324ACP-EVAL
1
2
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Thermal resistance measured on SEMI standard 4-layer board.
Thermal resistance measured on SEMI standard 4-layer board, paddle soldered to board.
Temperature Range
–25°C to +70°C
–25°C to +70°C
–25°C to +70°C
–40°C to +85°C
–40°C to +85°C
INDICATOR
SEATING
COPLANARITY
PLANE
PIN 1
1.00
0.85
0.80
0.010
0.004
C04339–0–10/03(0)
12° MAX
PIN 1
Figure 31. 20-Lead Shrink Small Outline Package [QSOP] (RQ-20)
0.004
Figure 30. 20-Lead Lead Frame Chip Scale Package [LFCSP]
BSC
0.50
BSC SQ
0.065
0.049
20
1
VIEW
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
TOP
4.0
COMPLIANT TO JEDEC STANDARDS MO-137AD
0.80 MAX
0.65 TYP
0.025
BSC
REF
0.20
Dimensions shown in millimeters
0.341
BSC
Dimensions shown in inches
4 mm × 4 mm Body (CP-20)
BSC SQ
Rev. 0 | Page 16 of 16
0.012
0.008
3.75
Package Description
20-Lead QSOP
20-Lead QSOP
20-Lead QSOP
Evaluation Board
20-Lead LFCSP
20-Lead LFCSP
Evaluation Board
0.05 MAX
0.02 NOM
0.069
0.053
11
10
SEATING
PLANE
COPLANARITY
0.154
MAX
0.75
0.55
0.35
BSC
0.60
0.08
MAX
0.60
0.236
BSC
0.010
0.006
15
11
10
16
BOTTOM
VIEW
0.30
0.23
0.18
8°
0°
20
6
1
5
θ
83.2
83.2
83.2
30.4
30.4
JA
0.050
0.016
0.25 MIN
(°C/W)
2.25
2.10 SQ
1.95
1
1
1
2
2
Package Option
RQ-20
RQ-20
RQ-20
CP-20
CP-20