MAX3283EAUT ETC [List of Unclassifed Manufacturers], MAX3283EAUT Datasheet - Page 3

• Manufacturer Part Number: MAX3283EAUT
• Description: PLASTIC ENCAPSULATED DEVICES
• Manufacturer: ETC [List of Unclassifed Manufacturers]

II. Manufacturing Information
III. Packaging Information
IV. Die Information
A. Description/Function: ±15kV ESD-Protected 52Mbps, 3V to 5.5V, RS-485/RS-422 True Fail-Safe Receivers
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
per JEDEC standard JESD22-A112: Level 1
S8 - Standard 8 micron silicon gate CMOS
233
California, USA
Malaysia or Thailand
January, 2002
6-Lead SOT23
Copper
Solder Plate
Silver-Filled Epoxy
Gold (1.0 mil dia.)
Epoxy with silica filler
Buildsheet # 05-9000-0327
Class UL94-V0
43 X 35 mils
Si
TiW/ AlCu/ TiWN
None
.8 microns (as drawn)
.8 microns (as drawn)
2.7 mil. Sq.
SiO
Wafer Saw
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide)