MAX3229EEBV MAXIM [Maxim Integrated Products], MAX3229EEBV Datasheet - Page 12

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MAX3229EEBV

Manufacturer Part Number
MAX3229EEBV
Description
Manufacturer
MAXIM [Maxim Integrated Products]
Datasheet
±15kV ESD-Protected +2.5V to +5.5V
RS-232 Transceivers in UCSP
Table 2. Reliability Test Data
12
Temperature Cycle
Operating Life
Moisture Resistance
Low-Temperature Storage
Low-Temperature
Operational
Solderability
ESD
High-Temperature Operating
Life
TTL/CMOS
C
______________________________________________________________________________________
BYPASS
0.1µF
0.1µF
C1
C2
TEST
0.1µF
C6
C1
D1
A2
A3
A6
B5
Typical Operating Circuits
C1+
C1-
C2+
C2-
T1IN
R1OUT
FORCEON
2.5V TO 5.5V
20µA
V
CC
MAX3229E
A1
V
L
GND
V
V
L
L
E1
1.65V TO 5.5V
V
L
-35°C to +85°C,
-40°C to +100°C
T
+20°C to +60°C, 90% RH
-20°C
-10°C
8hr steam age
±2000V, Human Body Model
T
V
L
A
J
A5
FORCEOFF
20µA
= +150°C
= +70°C
INVALID
T1OUT
5kΩ
R1IN
CONDITIONS
V+
V-
(continued)
B1
A4
E3
E5
E2
C5
TO POWER-
MANAGEMENT
UNIT
V
L
C3
0.1µF
C4
0.1µF
0.1µF
RS-232
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. CSP relia-
bility is integrally linked to the user’s assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering use
of a CSP package. Performance through Operating Life
Test and Moisture Resistance remains uncompromised
as it is primarily determined by the wafer-fabrication
process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Table 2 shows the testing done to characterize the CSP
reliability performance. In conclusion, the UCSP is capa-
ble of performing reliably through environmental stresses
as indicated by the results in the table. Additional usage
data and recommendations are detailed in the UCSP
application note, which can be found on Maxim’s web-
site at www.maxim-ic.com.
TRANSISTOR COUNT: 698
PROCESS TECHNOLOGY: CMOS
DURATION
150 cycles,
900 cycles
240hr
240hr
240hr
168hr
24hr
Chip Information
UCSP Reliability
NO. OF FAILURES PER
SAMPLE SIZE
0/200
0/10,
0/10
0/10
0/10
0/10
0/15
0/45
0/5

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