UPC37M31HB NEC [NEC], UPC37M31HB Datasheet - Page 9

• Manufacturer Part Number: UPC37M31HB
• Description: BIPOLAR ANALOG INTEGRATED CIRCUIT
• Manufacturer: NEC [NEC]

RECOMMENDED MOUNTING CONDITIONS
different conditions.
Type of Surface Mount Device
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
Type of Through-hole Device
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
The following conditions must be met for mounting conditions of the PC37M31 and 37M32.
For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
Infrared Ray Reflow
Vapor Phase Soldering
Wave Soldering
Partial Heating Method
Wave Soldering
(only to leads)
Partial Heating Method
PC37M31TJ,
PC37M31HB,
Process
Process
device will be damaged by heat stress.
that the package body does not get jet soldered.
PC37M32TJ: MP-3Z (5-pin)
PC37M32HB: MP-3 (5-pin)
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflows processes: 3 times or less.
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflows processes: 3 times or less.
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Data Sheet G16444EJ1V0DS
Conditions
Conditions
PC37M31,37M32
WS60-00-1
VP15-00-3
IR35-00-3
Symbol
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